FUJIMI INCORPORATED

The Group consists of the Company and 5 subsidiaries (as of 31 March 2026) and is primarily engaged in the manufacture and sale of abrasives and related products. Its business encompasses the research and development, manufacture and sale of a broad range of abrasives and processing materials, centered on ultra-precision abrasives for silicon wafers and including CMP materials, abrasives for disk substrates, thermal-spray materials and polishing solutions. Its principal products and services include ultra-precision abrasives for semiconductor substrates, CMP materials, disk materials, thermal-spray materials and comprehensive polishing solutions. The domestic market is Japan, while overseas operations cover North America, Asia and Europe, with local sales systems established through local subsidiaries. Over the long term, the Company’s basic policy is to evolve into a “Powder & Surface Company,” and it has formulated a medium- to long-term management plan. The plan includes targets such as consolidated net sales of ¥77.0 billion, a consolidated non-semiconductor sales ratio of 20.0%, an EBITDA margin of 26.0% and ROE of 15.0%. Current results are ¥69.4 billion, a non-semiconductor sales ratio of 16.6%, an EBITDA margin of 23.3% and ROE of 11.3%. The dividend policy targets a consolidated dividend payout ratio of at least 55%, with the Company aiming to maintain or increase dividends during the plan period. The Company has identified 18 materiality issues across four areas: environment, society, governance and value creation, with climate change response positioned as a key issue.