Development of Products for High-Precision Polishing Materials and Power Device Substrates

「Against this backdrop, strong sales of CMP products for advanced semiconductors and products for silicon wafers resulted in first-quarter cumulative consolidated results of net sales of ¥19,520 million, up 19.1% year on year, operating income of ¥4,607 million, up 41.5%, ordinary income of ¥4,831 million, up 75.7%, and net income attributable to owners of the parent of ¥3,371 million, up 81.0%.」

「For polishing materials for difficult-to-process materials, including SiC and GaN substrates used in power devices, we are working to develop new products and processes that deliver high speed and superior surface quality.」

「Driven by strong sales of CMP products for advanced semiconductors and polishing materials for silicon wafers, results for the fiscal year were net sales of ¥69,404 million, up 11.0% year on year, and operating income of ¥13,826 million, up 17.4%.」

「For products for silicon wafers, sales were ¥3,711 million for lapping materials, down 2.1% year on year, and ¥6,928 million for polishing materials, up 13.1%. For CMP products, increased sales for leading-edge logic and memory applications resulted in sales of ¥16,732 million, up 11.3% year on year.」

「We are also advancing the development of products for SiC substrates, for which demand is rising with the spread of electric and hybrid vehicles, and are proceeding with production at our US and Malaysian sites to supply products to customers worldwide.」

「For products for silicon wafers, supported by high utilization in the semiconductor industry, sales of lapping materials were ¥1,540 million, up 6.7% year on year, and sales of polishing materials were ¥3,504 million, up 19.5%. For CMP products, demand remained strong for both logic and memory applications, and the impact of foreign exchange movements also contributed, resulting in sales of ¥7,645 million, up 28.2% year on year.」

「For products for silicon wafers, supported by high utilization in the semiconductor industry, sales of lapping materials were ¥4,694 million, up 40.6% year on year, and sales of polishing materials were ¥9,069 million, up 29.2%. For CMP products, demand remained strong for both logic and memory applications, resulting in sales of ¥18,442 million, up 23.2% year on year.」

「For products for silicon wafers, supported by high utilization in the semiconductor industry, sales of lapping materials were ¥2,985 million, up 38.3% year on year, and sales of polishing materials were ¥6,007 million, up 32.9%. For CMP products, demand remained strong for both logic and memory applications, resulting in sales of ¥12,155 million, up 20.9% year on year.」

「For products for silicon wafers, supported by high utilization in the semiconductor industry, sales of lapping materials were ¥1,442 million, up 22.3% year on year, and sales of polishing materials were ¥2,931 million, up 28.3%. For CMP products, demand for logic applications remained strong, demand for memory applications began to recover, and certain customers built up inventories of CMP products. As a result, sales were ¥5,963 million, up 18.9% year on year.」

「For lapping materials, we are working to develop mass-production technologies focused primarily on silicon-wafer applications, with quality improvement and cost reduction in mind. Products developed through this work have been adopted by some customers.」

「For products for silicon wafers, supported by high utilization in the semiconductor industry, sales of lapping materials were ¥3,340 million, up 16.9% year on year. Sales of polishing materials were ¥7,017 million, broadly in line with the previous year and up 3.4%, reflecting inventory buildup of our products by certain customers in the same period of the previous year. For CMP products, although demand for memory applications showed signs of leveling off, demand for logic applications remained strong, and sales increased for both logic and memory products for leading-edge devices, resulting in sales of ¥14,971 million, up 17.4% year on year.」

「For products for silicon wafers, in addition to high utilization in the semiconductor industry, customers also built up silicon wafer inventories. As a result, sales of lapping materials were ¥2,158 million, up 17.7% year on year. Sales of polishing materials were ¥4,521 million, broadly in line with the previous year and up 0.8%, reflecting inventory buildup of our products by certain customers in the second quarter of the previous fiscal year. For CMP products, against a backdrop of high utilization in the semiconductor industry driven by increased demand from data centers and PCs, sales of products for leading-edge devices increased for both logic and memory applications, resulting in sales of ¥10,055 million, up 18.5% year on year.」

「For products for silicon wafers, in addition to high utilization in the semiconductor industry, customers also built up silicon wafer inventories. As a result, sales of lapping materials were ¥1,179 million, up 19.2% year on year, and sales of polishing materials were ¥2,284 million, up 4.2%. For CMP products, against a backdrop of high utilization in the semiconductor industry driven by increased demand from data centers and PCs, sales of products for leading-edge devices increased for both logic and memory applications, resulting in sales of ¥5,015 million, up 30.3% year on year.」

「For products for silicon wafers, sales of lapping materials were ¥2,856 million, down 13.6% year on year, particularly due to the slowdown in the small-diameter silicon-wafer market. By contrast, sales of polishing materials were ¥6,787 million, up 4.3%, reflecting the expanded adoption of our products.」

「We will continue to provide highly differentiated new products supported by new technologies, with the aim of becoming the most trusted partner. We are also focusing on developing products for power-device substrates, which have attracted attention in recent years, and some products have already been launched.」

「For products for silicon wafers, sales of lapping materials were ¥988 million, down 3.2% year on year, due to the slowdown in the small-diameter silicon-wafer market. By contrast, sales of polishing materials were ¥2,192 million, up 3.8%, reflecting the expanded adoption of our products.」

「For final polishing materials for silicon wafers, reducing extremely small defects on wafer surfaces, including particles, imperfections and foreign matter, and improving surface smoothness have become increasingly important as semiconductor devices become finer. In recent years, we have developed polishing materials that reduce extremely small defects while producing smoother surfaces with greater precision, and they have been adopted by major customers. We are also developing primary and secondary polishing materials based on a new concept that contributes to greater processing precision and productivity, and these products have been adopted by many customers.」

「For products for silicon wafers, sales of lapping materials were ¥3,304 million, up 24.9% year on year, and sales of polishing materials were ¥6,505 million, up 18.7%, reflecting high semiconductor-industry utilization and the expanded adoption of our products.」

「For products for silicon wafers, sales of lapping materials were ¥2,176 million, up 25.4% year on year, and sales of polishing materials were ¥4,301 million, up 26.8%, reflecting the strong semiconductor market and the expanded adoption of our products.」

「For products for silicon wafers, sales of lapping materials were ¥1,021 million, up 14.4% year on year, and sales of polishing materials were ¥2,112 million, up 27.3%, reflecting the strong semiconductor market and the expanded adoption of our products.」

「We are also focusing on developing products for power-device substrates, which have attracted attention in recent years, and some products have already been launched.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「In recent years, we have developed polishing materials that reduce extremely small defects while producing smoother surfaces with greater precision, and they have been adopted by major customers. We are also developing primary and secondary polishing materials based on a new concept that contributes to greater processing precision and productivity, and these products have been adopted by many customers.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」

「We will provide highly differentiated new products supported by new technologies in response to customers' increasingly sophisticated requirements, with the aim of becoming their most trusted partner. We will also focus on developing products for power-device substrates, which have attracted attention in recent years.」