Expansion of Ultrasonic Cutting and Wet-Processing Equipment into Growth Markets

「During the current consolidated fiscal year, the company worked to identify new markets and gather customer feedback in response to expanding demand in optoelectronic integration and automotive sensors and to diverse customer needs. It also sought to raise awareness of the equipment business and acquire new customers through overseas trade-show participation and stronger collaboration with partner companies, continuing initiatives aimed at sustainable growth.」

「当期においては、光電融合及び車載センサー分野における需要拡大や顧客の多様なニーズに対応すべく、新規市場や顧客の声の獲得に向け取組んでまいりました。さらに、海外での展示会出展やパートナー企業との連携強化を通じて、装置事業の認知度向上と新規顧客の獲得を図り、持続的な成長に向けた取組みも継続してまいりました。」

「In the equipment business, with a focus on responding to expanding demand in optoelectronic integration and automotive sensor applications, the company advanced initiatives to research new markets and gather customer feedback in order to meet diverse customer needs, and developed the foundation for business expansion. It also sought to raise awareness of the equipment business and acquire new customers through trade-show participation and stronger collaboration with partner companies, continuing initiatives aimed at sustainable growth.」

「In the equipment business, the company advanced the acquisition of new customers by strengthening its production and development systems, accelerating overseas expansion, and actively exhibiting at trade shows to address robust capital investment in the semiconductor industry.」

「For ultrasonic cutting equipment, the company expanded sales channels into sensor markets for smartphones, wearable devices, and other products, as well as power-device markets for automotive and energy applications, contributing to carbon neutrality. For single-wafer wafer-cleaning equipment, it also developed environmentally considerate equipment and worked to enhance customer services and increase earnings while contributing to the SDGs.」

「The company deployed its equipment in growth markets advancing digitalization, energy conservation, and the transition to green technologies, including sensors such as smartphones and wearable devices, power semiconductors for automotive and energy applications, and communications such as 5G, while seeking to expand sales channels by addressing the further needs of existing customers.」

「For ultrasonic cutting equipment, the company developed a new series with improved productivity and additional functions, began sales in December 2020, and worked to expand sales.」

「The equipment developed by the equipment business has been deployed in growth markets represented by sensors such as smartphones and wearable devices, power semiconductors for automotive and energy applications, and communications such as 5G, while the company sought to expand sales channels by addressing the further needs of existing customers.」

「The equipment developed by the equipment business has been deployed in growth markets represented by IoT, including sensors such as smartphones and wearable devices, power semiconductors for automotive and energy applications, and communications such as 5G, while the company promoted stronger equipment manufacturing capabilities and cost reductions.」

「For ultrasonic cutting equipment, the company promoted market expansion and differentiation from competitors by leveraging its equipment-development capabilities, including process development, design, and manufacturing, in its areas of expertise such as SiC and ceramics, enabling it to respond flexibly to customer requirements. For various cleaning equipment, it promoted shorter delivery times and lower costs through modularization.」

「For ultrasonic cutting equipment, the company increased sales in mass-production applications for SiC, ceramics, and other materials and in analytical applications for electronic components, while developing and strengthening core components to maintain future competitiveness. For single-wafer wet-processing equipment, it expanded its product lineup from mass-production to development applications and increased sales.」

「The ultrasonic cutting equipment business has expanded its track record in equipment for mass production of SiC power devices and has also increased sales of equipment used in cross-sectional observation processes. For single-wafer wet-processing equipment, in addition to its established track record with MEMS and LED applications, the company sought to acquire new customers by targeting growth markets such as IoT.」