Commercialization of AI-Based Crack and Void Analysis
First written in FY2023. 4 of 5 entries say "Advanced", first in FY2024. Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026AdvancedAnnual report
「Some of the development results are being commercialized in the form of Qualap, an AI image inspection platform. The Company is continuing development of Qualap to further improve performance and deliver a more user-friendly interface.」
The Company is working to commercialize AI-based void and crack analysis as Qualap, an AI image inspection platform, while pursuing performance improvements and user-interface development. - 2026-08-07AdvancedManagement Planning
「AI-based 3D nondestructive analysis of solder cracks and X-ray void inspection technology」
The combination of X-ray CT and AI for analysis has shown concrete progress toward commercialization, including the number of contracted projects, software sales licenses and registered patents. - FY2025AdvancedAnnual report
「To elucidate the mechanism behind solder-crack formation, we are currently focusing on developing an application that observes the joining conditions of various components, including chip resistors, chip capacitors, SOPs (Small Outline Packages), BGAs (Ball Grid Arrays), and interfaces between semiconductors and lead frames, and provides a new failure-analysis method incorporating artificial intelligence into the observed results. We presented our research results at the Welding Society’s autumn national conference held in September 2024 and at a special session of MES2024, the 34th Microelectronics Symposium.」
In addition to presenting research on an AI-based crack-analysis application, the company disclosed development results for a Human-in-the-loop AI image-inspection platform. - FY2024AdvancedAnnual report
「To elucidate the mechanism behind crack formation, we are currently focusing on developing an application that observes the joining conditions of various components and provides a new failure-analysis method incorporating artificial intelligence into the observed results. We presented our research results at the 16th Electronics Circuit World Convention (ECWC-16), held in April 2024.」
Research results on an AI-based crack-analysis application were presented at a conference in April 2024, indicating progress at the research stage toward commercialization. - FY2023First statedAnnual report
「We aim to commercialize AI-based analysis technology by jointly selling it with manufacturers of analytical equipment such as X-ray systems, including analysis of cracks and voids using AI. We are currently proposing a void-analysis application to several customers and advancing commercialization efforts, including improving analytical performance and customizing the application for individual users.」
The company is commercializing its AI analysis application through proposals to several customers, improved analytical performance and customer-specific customization.