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Lasertec (6920) · InitiativeAdvanced

Development of AI-Based Automated Defect Classification

First written in FY2016. 5 of 10 entries say "Advanced", first in FY2018. Latest entry: FY2026.

10entries
11years
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How it moved
ProgressHeldSoftenedWorseFirst statedFY2016 – FY2017RestatedFY2019 – FY2021AdvancedFY2022 – FY20262016: 12017: 120172018: 120182019: 120192020: 120202021: 120212022: 120222023: 120232024: 020242025: 120252026: 12026
Same theme, other companies
Development and expansion of the AI and proprietary image inspection systems and equipment businessA theme 18 companies write about · 0 as a headwind · 20 as a tailwind

The whole theme swung hardest in 2022: 1 of 7 companies on the "Worse" side.

5 other companies' latest entry also says "Advanced".

Ridges = years it wrote progress, valleys = years it wrote worse. Most hopeful companies at the back. Drag to turn, scroll to zoom, right-drag to pan. On a phone, two fingers turn and pinch to zoom; one finger scrolls the page.
Showing 14 of the 18 companies compared. The sentences above are computed from all 18.
Full recordFilings, disclosures and news, newest first
  1. FY2026AdvancedAnnual report

    「The system also offers a range of applications, including defect-type determination, and contributes to CNT pellicle quality control through use by a broad range of customers, from pellicle manufacturers to device manufacturers.」

    PELMIS EPM200 enabled automated classification of particles on the front and back surfaces and defect-type determination, expanding the application of AI and automated classification technologies to pellicle quality control.
  2. FY2025AdvancedAnnual report

    「This system features high-precision defect classification and judgment functions using our proprietary deep-learning technology, enabling the early detection and analysis of defects that cause device failures.」

    Added defect classification and judgment functions using proprietary deep-learning technology to SICA108, expanding the scope of AI-based defect detection and analysis.
  3. FY2023AdvancedAnnual report

    「In CIEL, we completely redesigned the optical system of EZ300 to achieve high-sensitivity, high-throughput inspection. As semiconductor devices become finer and more highly stacked, defects originating at wafer edges are increasing. This product meets customers’ need to detect and classify only those defects among the various types that reduce yield. It combines high-precision defect classification using deep-learning technology with the 3D functionality of its proprietary optical system, enabling the acquisition of high-resolution images containing height and depth information and enhancing the ability to extract defects requiring detection.」

    Implemented high-precision deep-learning classification in CIEL for AI-based automated defect classification and expanded functionality to include defect extraction using 3D image information.
  4. FY2022AdvancedAnnual report

    「We also offer advanced inspection functions, including high-precision image classification, patterned-substrate inspection and extraction of specific types of defects, using AI inspection technology based on deep learning.」

    Implemented deep-learning image classification and defect-extraction functions in OPTELICS AI² for AI-based automated defect classification.
  5. FY2021RestatedAnnual report

    「In addition, we continue to deepen our precision mechanics technologies for developing high-precision, high-speed stages and our image-processing technologies for defect detection. In recent years, we have also advanced the development of automated defect classification using AI (artificial intelligence), pursuing research and product development that enables us to provide timely solutions to customer needs.」

    Continuing to deepen precision mechanics and image-processing technologies and develop automated defect classification using AI.
  6. FY2020RestatedAnnual report

    「In addition, we continue to deepen our precision mechanics technologies for developing high-precision, high-speed stages and our image-processing technologies for defect detection. In recent years, we have also advanced the development of automated defect classification using AI (artificial intelligence), pursuing research and product development that enables us to provide timely solutions to customer needs.」

    Continuing to deepen precision mechanics and image-processing technologies and develop automated defect classification using AI.
  7. FY2019RestatedAnnual report

    「In addition, we continue to deepen our precision mechanics technologies for developing high-precision, high-speed stages and our image-processing technologies for defect detection. In recent years, we have also advanced the development of automated defect classification using AI (artificial intelligence), pursuing research and product development that enables us to provide timely solutions to customer needs.」

    Continuing to deepen precision mechanics and image-processing technologies and develop automated defect classification using AI.
  8. FY2018AdvancedAnnual report

    「For defect classification, we use a high-speed processing computer and a trained model based on machine-learning algorithms, including the latest deep learning. Based on high-resolution review images produced using the core technologies described above, the system accurately classifies various defects with irregular shapes as they are detected.」

    Implemented machine-learning algorithms, including deep learning, in the GALOIS GaN wafer inspection system for AI-based automated defect classification.
  9. FY2017RestatedAnnual report

    「In addition, we continue to deepen our precision mechanics technologies for developing high-precision, high-speed stages and our image-processing technologies for defect detection. In recent years, we have also advanced the development of automated defect classification using AI (artificial intelligence), pursuing research and product development that enables us to provide timely solutions to customer needs.」

    Continuing to deepen precision mechanics and image-processing technologies and develop automated defect classification using AI.
  10. FY2016First statedAnnual report

    「In addition, we continue to deepen our precision mechanics technologies for developing high-precision, high-speed stages and our image-processing technologies for defect detection. In recent years, we have also advanced the development of automated defect classification using AI (artificial intelligence), pursuing research and product development that enables us to provide timely solutions to customer needs.」

    Deepening precision mechanics and image-processing technologies while advancing the development of AI-based automated defect classification.
Moved together

"Launch of New Products and Expansion of the Inspection and Measurement Equipment Lineup" moved the same way as this thread, in the same document, in 5 of its 10 moves.

554444★123456
  1. ★This thread
  2. 1Launch of New Products and Expansion of the Inspection and Measurement Equipment Lineup5×
  3. 2Expansion of the services business5×
  4. 3Phase-based management of the 9-year medium-term management plan4×
  5. 4Establishing a new business platform centered on semiconductor wafer-related equipment4×
  6. 5Contribution to earnings from new EUVL products and the new wafer business in Phase III4×
  7. 6Stable shareholder returns guided by a consolidated dividend payout ratio of 35%4×

★ is this thread; numbers match the list above. The number on a line is how many documents both moved the same way in; lines between the other threads count the documents they moved together in too. Threads that move together often sit closer.

When this could move next
Lasertec's next results are scheduled for 2026-10-30. Read the earnings preview
News
No news is linked to this thread yet. When an article touches it, it will appear here by date.
Development of AI-Based Automated Defect Classification | Lasertec Corporation (6920) | Komori