Establishing a new business platform centered on semiconductor wafer-related equipment
First written in FY2016. 6 of 9 entries say "Advanced", first in FY2017. Latest entry: FY2026.
1 other company's latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Ultrashort-Pulse Laser-Excited Microscope OPTELICS UXM OPTELICS UXM is a system that enables nondestructive evaluation of the three-dimensional structures of internal defects in wafers made from wide-bandgap (WBG) compound semiconductors.」
The Company introduced a new product for nondestructive, three-dimensional evaluation of internal defects in WBG compound semiconductor wafers, expanding its wafer-related inspection and metrology business. - FY2025AdvancedAnnual report
「SiC Wafer Defect Inspection/Review System SICA108 Series SICA108 features a completely redesigned inspection optical system compared with the previous model, SICA88, achieving higher throughput, improved assessment of SiC wafer quality, and a lower cost of ownership.」
In SiC wafer inspection, the Company launched the SICA108 series, an upgraded version of the previous SICA88, advancing its inspection optics, throughput, and defect classification and judgment functions. - FY2024AdvancedAnnual report
「The Via Depth Measurement System VIANCA Series VIANCA is a system that enables highly precise measurement of the etch depth of small-diameter, high-aspect-ratio vias required for next-generation processes.」
The Company commercialized the VIANCA series, a system for measuring the depth of small-diameter, high-aspect-ratio vias in HBM manufacturing processes, entering a new semiconductor-related metrology field. - FY2023AdvancedAnnual report
「The High-Sensitivity Wafer Edge Inspection System CIEL Series, CIEL, achieves high-sensitivity, high-throughput inspection through a complete redesign of the optical system used in EZ300.」
The Company launched the CIEL series for detecting and classifying wafer-edge defects in its wafer-related new business, establishing a concrete product foundation. - FY2020RestatedAnnual report
「Particularly during Phase III, new products related to EUV and wafer inspection, cultivated through Phase II, have finally entered the harvest phase. We will strengthen our organizational structure to maximize the returns from the new businesses and contribute to the Group's significant growth.」
The Company continues to position EUV- and wafer inspection-related new businesses as being in the harvest phase and to pursue a policy of strengthening its organizational structure to maximize the harvest. - FY2019RestatedAnnual report
「Particularly during Phase III, new products related to EUV and wafer inspection, cultivated through Phase II, will finally enter the harvest phase. We will ensure that the new businesses bear fruit and contribute to the Group's significant growth.」
The Company continues to pursue a policy of treating new businesses related to EUV and wafer inspection as being in the harvest phase of Phase III. - FY2018AdvancedAnnual report
「Particularly during Phase III, new products related to EUVL and wafer inspection, cultivated through Phase II, will finally enter the harvest phase. We will ensure that the new businesses bear fruit and contribute to the Group's significant growth.」
The Group positioned new businesses, including wafer inspection, as moving from the foundation-building stage into Phase III's harvest phase and contribution-to-results stage. - FY2017AdvancedAnnual report
「The Company successfully captured a high market share for its SiC wafer defect inspection/review systems and will pursue further market share gains. For other semiconductor wafer-related inspection and metrology systems, the Company aims to raise awareness among customers and increase unit sales.」
The Company stated that it had successfully captured a high market share for SiC wafer defect inspection/review systems and advanced initiatives to increase its share further and raise unit sales of other wafer-related systems. - FY2016First statedAnnual report
「The Company will expand its lineup of semiconductor wafer-related inspection and metrology systems, including the lithography process inspection system announced in Phase I, which has already established a track record, and build the foundation for future growth.」
The Company plans to expand its lithography process inspection systems and wafer-related inspection and metrology systems to build a foundation for growth.