As part of developments related to AI semiconductors, NVIDIA is reportedly moving to use TSMC’s 3nm base die for NVHBM, while equipment suppliers including ASML are also seeing increased activity. TSMC has also discussed expanding its 3nm fabs and equipment plans in Texas.
NVIDIA is reportedly advancing a plan to use the base die from TSMC’s 3nm process for NVHBM, while strengthening of the supply chain, including HBM support by Samsung, SK Hynix and Micron, has become a subject of discussion. Multiple reports from TrendForce and other media outlets are mixed together, and the article does not provide specific quantities.
ASML has reportedly been taking steps toward expanding the applications of hybrid bonding in light of developments surrounding the installation of semiconductor equipment by Chinese companies. Reports from the South China Morning Post and TrendForce have also noted growing interest in hybrid bonding technology both in Japan and overseas.