Fujifilm will invest approximately ¥3 billion in its semiconductor materials facility in Mesa, Arizona, United States, expanding production capacity for CMP slurry used in copper interconnects and constructing new multi-product production facilities covering front-end and back-end processes. The new facilities are scheduled to begin operations in 2027.
Fujifilm announced on 14 October that it would expand production capacity for CMP slurry used in copper interconnects at its facility in Mesa, Arizona, United States, and construct new multi-product production facilities to accommodate the standardization of front-end and back-end processes. Total investment is approximately $18 million (approximately ¥3.0 billion), and operations are scheduled to begin in 2027.
CMP slurry is an abrasive used to uniformly planarize semiconductor surfaces, and the company is said to hold a high global market share in CMP slurry for copper interconnects. Against a backdrop of growing demand in the United States for advanced logic and advanced memory applications, the company plans to increase the facility's supply capacity.
The new facilities will support CMP slurry for BEOL applications, as well as include front-end facilities supporting multiple CMP slurry products for FEOL and MOL applications. They will also support production of CMP slurry for advanced packaging applications such as hybrid bonding.
The Arizona facility also houses a CMP slurry research and development center. Fujifilm is establishing a system to rapidly transfer development results to mass-production facilities and plans to strengthen its ability to meet demand for advanced semiconductors, particularly in the United States.