富士フイルム will expand its CMP slurry production site in Mesa, Arizona, U.S., investing approximately $18 million in total, with operations scheduled to begin in 2027. The company will expand production capacity for slurry used in copper wiring and install new facilities for advanced packaging applications.
On 14 October, 富士フイルム announced a capital investment in its CMP slurry production and development site in Mesa, Arizona, U.S. In addition to expanding production capacity for CMP slurry used in copper wiring, the company will install new multi-product production facilities capable of serving front-end applications as well as back-end applications such as hybrid bonding. The total investment will be approximately $18 million, with operations expected to begin in 2027.
The main purpose of the expansion is to increase production capacity for CMP slurry used in copper wiring. In addition, the company plans to equip the site to serve both front-end and back-end applications and ship products for a wide range of uses within and outside the United States. Specific figures for the production increase have not been disclosed.
富士フイルム is said to hold one of the world's leading shares in CMP slurry for copper wiring, with its U.S. subsidiary operating the site. The investment is positioned as part of an expansion of the company's global supply network, following announcements on the installation of CMP slurry facilities at its site in Belgium and the expansion of production capacity at its Kumamoto site.
As capital investment by U.S. semiconductor manufacturers accelerates, the importance of stable local supplies of materials is increasing. Against a backdrop of growing AI-related demand, local production by materials manufacturers may continue to expand.