Samsung Electronics of South Korea has opened a new semiconductor research base in Yokohama, where it will advance packaging technologies and work with Japanese companies to develop cutting-edge technologies for AI.
Samsung Electronics, a major South Korean semiconductor manufacturer, held an opening ceremony for a newly established research and development base in Yokohama. The base aims to enhance semiconductor manufacturing competitiveness by collaborating with Japanese companies with strengths in semiconductor materials and manufacturing equipment. About 100 people, including lawmakers who attended as guests and representatives of Japanese manufacturing equipment companies, were present.
The base is equipped with cleanrooms and analytical facilities and began full-scale operations in January this year. It will focus on developing advanced packaging technologies such as 3DIC, with research underway into technologies that improve performance by combining multiple semiconductor chips three-dimensionally.
Local officials emphasized Japan-South Korea cooperation, saying that they would use South Korea’s world-class semiconductor design and manufacturing capabilities together with Japan’s strengths to shape the future of semiconductors from Yokohama. They also indicated a policy of maximizing the strengths of Japanese companies in materials and equipment through collaboration.
Samsung Electronics Vice Chairman and other executives overseeing the company’s semiconductor operations attended the opening ceremony and expressed their intention to advance the development of cutting-edge technologies in anticipation of demand associated with the spread of AI, while obtaining cooperation from Japanese companies.