Capital Investment Plan for R&D and Production Facilities
First written in FY2017. 18 of 28 entries say "Advanced", first in FY2018-Q3. Latest entry: 2026-10-30.
The whole theme swung hardest in 2019: 1 of 6 companies on the "Worse" side.
6 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「SCREEN Advanced Technology Center of America, LLC Head Office Facility (New York, USA) Company-wide (common) Facilities for research and development 12,000 April 2026 March 2028」
The company disclosed a ¥12,000 million investment plan for R&D facilities at ATCA, with completion scheduled for March 2028. It also plans to acquire land for production, install extra-high-voltage power receiving and transformation facilities, and renew its core business systems. - 2026-05-13AdvancedEarnings
「設備投資額 29,729 27,710 △2,018 △6.8％ 21,000 43,000」
2026年3月期の設備投資額を277億10百万円とし、2027年3月期は430億円を計画している。 - FY2026-H1AdvancedAnnual report
「Company filing the report and SCREEN Semiconductor Solutions Co., Ltd. Head Office Facility (Kamigyo-ku, Kyoto) Company-wide (common) SPE Renewal of core business systems 10,760 4,389 November 2024 January 2027 - Company filing the report Undecided (Yasu, Shiga) Company-wide (common) Acquisition of land for production 4,700 211 June 2026 Undecided -」
The filing states that the planned investment in the renewal of core business systems is ¥10,760 million, with ¥4,389 million paid to date and completion scheduled for January 2027. It also states that the planned investment in the acquisition of land for production is ¥4,700 million, with ¥211 million paid to date, construction scheduled to start in June 2026, and the completion date undecided. - FY2025-H1AdvancedAnnual report
「The progress of major capital expenditures that were planned as of the end of the previous consolidated fiscal year is as follows. Company Facility (Location) Segment Description of facilities Planned investment (¥ millions) Total Amount paid to date Start of construction Completion Company filing the report Hikone Facility (Hikone, Shiga) Company-wide (common) Construction of a new plant with production space and office functions for the hydrogen-related business 11,123 7,645 February 2024 December 2024」
The investment plan for the new building for the hydrogen-related business totals ¥11,123 million, of which ¥7,645 million had been paid as of the reporting date, with completion scheduled for December 2024. - FY2024AdvancedAnnual report
「The major capital projects and other projects that were under planning at the end of the previous consolidated fiscal year and completed during the current consolidated fiscal year are as follows. Reporting company and SCREEN Semiconductor Solutions Co., Ltd.; Hikone site (Hikone, Shiga Prefecture) Company-wide (common); SPE Construction of a semiconductor manufacturing equipment production plant 7,746 March 2024 20%」
Construction of the semiconductor manufacturing equipment production plant at the Hikone site was completed in March 2024, resulting in a 20% increase in capacity. The capital investment plan for the following year was set at ¥30 billion. - FY2024-Q3AdvancedAnnual report
「The major capital projects and other projects that were under planning at the end of the previous consolidated fiscal year and completed during the nine months ended the third quarter of the current consolidated fiscal year are as follows.」
Following the expansion and improvement of production facilities at the Takaoka site, capacity expansion of existing production facilities at SCREEN SPE Quartz was completed in November 2023, with investment of ¥1,807 million. Construction of the semiconductor manufacturing equipment production plant at the Hikone site was also progressing, with ¥7,366 million paid to date and completion scheduled for January 2024. - FY2024-Q2AdvancedAnnual report
「The major capital projects that were under planning at the end of the previous consolidated fiscal year and completed during the six months ended the second quarter of the current consolidated fiscal year are as follows.」
Expansion and improvement of production facilities at the Takaoka site were completed in July 2023, with investment of ¥6,205 million. Progress on construction of the semiconductor manufacturing equipment production plant at the Hikone site was also updated, and a new building plan totaling approximately ¥11 billion for production space and other facilities for the hydrogen-related business was finalized. - FY2024-Q1AdvancedAnnual report
「Construction of a semiconductor manufacturing equipment production plant: 8,474; 4,180; February 2023; January 2024; 20%. Expansion and improvement of production facilities: 6,211; 6,056; December 2022; July 2023.」
The planned total investment for construction of the semiconductor manufacturing equipment production plant was updated to ¥8,474 million, with ¥4,180 million paid to date and completion scheduled for January 2024. Expansion and improvement of production facilities at SCREEN SPE Works had reached ¥6,056 million paid to date, with completion scheduled for July 2023. - FY2023AdvancedAnnual report
「The major capital projects that were under planning in the previous consolidated fiscal year and completed during the current consolidated fiscal year are as follows. Reporting company and SCREEN Semiconductor Solutions Co., Ltd.; Hikone site; construction of a semiconductor manufacturing equipment production plant and renovation of existing facilities; 8,575; December 2022; 20%.」
The semiconductor manufacturing equipment production plant at the Hikone site was completed in December 2022, resulting in a 20% increase in capacity. In addition, the plan to construct a new S³-5 plant is progressing. - FY2023-Q3AdvancedAnnual report
「The new semiconductor manufacturing equipment plant, which had been under construction since January 2022, was completed in December 2022 and began operations in January 2023.」
The new semiconductor manufacturing equipment plant, under construction since January 2022, was completed in December 2022 and began operations in January 2023. The existing plan reached its specified completion and operating milestones. - FY2023-Q2AdvancedAnnual report
「To further expand production capacity in the semiconductor manufacturing equipment business (SPE), we plan to construct a new plant at the Hikone site and invest in capacity expansion at domestic group companies. Planned capital investment totals approximately ¥16 billion, funded with internal funds. The new plant is scheduled for completion in October 2023 and commencement of operations in January 2024. The amount paid to date at the end of the second quarter was ¥1,496 million.」
The company disclosed ¥1,496 million paid to date at the end of the second quarter for the approximately ¥16 billion plan to construct a new plant at Hikone and expand capacity at domestic group companies. Under the existing capital investment plan at the Hikone site, ¥4,542 million had been paid to date for the new plant and facility renovations. - FY2023-Q1RaisedAnnual report
「To further expand production capacity in the semiconductor manufacturing equipment business (SPE), we plan to construct a new plant at the Hikone site and invest in capacity expansion at domestic group companies. Planned capital investment totals approximately ¥16 billion, funded with internal funds. The new plant is scheduled for completion in October 2023 and commencement of operations in January 2024.」
In addition to the previous plans for a new plant and facility expansion at the Hikone site, the company newly finalized a plan totaling approximately ¥16 billion, including investment to expand capacity at domestic group companies. The new plant is scheduled for completion in October 2023 and commencement of operations in January 2024. - FY2022-Q3AdvancedAnnual report
「To further expand production capacity in the semiconductor manufacturing equipment business (SPE), we plan to construct a new plant and renovate existing facilities at the Hikone site, as well as expand site facilities. Planned capital investment comprises ¥8.4 billion for construction of the new plant and renovation of existing facilities and ¥2.5 billion for expansion of site facilities, funded with internal funds. The new plant is scheduled for completion in November 2022 and commencement of operations in January 2023.」
The company newly finalized a ¥10.9 billion capital investment plan for the Hikone site, comprising ¥8.4 billion for construction of a new plant and renovation of existing facilities and ¥2.5 billion for expansion of site facilities. The new plant is scheduled for completion in November 2022 and commencement of operations in January 2023. - FY2022-Q2Update on second-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥2,856 million, compared with ¥1,471 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities for the six months ended was ¥2,856 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2022-Q1Updated first-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥1,688 million, compared with ¥760 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities for the three months ended was ¥1,688 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2021-Q2RestatedAnnual report
「There are no material changes from the information stated in the first-quarter report.」
The company stated that there are no material changes to the current-year capital investment plan from the information stated in the first-quarter report. The ¥11 billion capital investment plan formulated in the first quarter and the completed expansion of facilities at the French site remain unchanged. - FY2021-Q1AdvancedAnnual report
「The total capital investment plan for the current consolidated fiscal year is ¥11 billion, including intangible assets,」
The capital investment plan for the current fiscal year, which had been undecided while the impact of the COVID-19 pandemic was assessed, was formulated at a total of ¥11 billion. In addition, the expansion of semiconductor manufacturing equipment production and R&D facilities at the French site was completed, with investment of ¥1,388 million, completion in June 2020 and a 100% increase in capacity. - FY2020SoftenedAnnual report
「The company previously disclosed the total capital investment plan for the one-year period following the current consolidated fiscal year by segment, but the amount is currently undecided because an annual plan reflecting the impact of the COVID-19 pandemic is being formulated.」
The capital investment amount for the following year, previously disclosed, was changed to undecided while a plan reflecting the impact of the COVID-19 pandemic is being formulated. - FY2020-Q3Updated third-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥8,226 million, compared with ¥17,706 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities for the nine months ended was ¥8,226 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2020-Q2Update on second-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥6,980 million, compared with ¥11,922 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities for the six months ended was ¥6,980 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2020-Q1Updated first-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥5,243 million, compared with ¥6,180 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities in the first quarter was ¥5,243 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2019-Q3AdvancedAnnual report
「Construction of a semiconductor manufacturing equipment production plant: 5,632; 4,674; February 2018; December 2018; 50%.」
For construction of the semiconductor manufacturing equipment production plant at the Hikone site, the amount paid to date increased from ¥2,219 million in the second quarter to ¥4,674 million. Construction of the display manufacturing equipment and deposition equipment production plant had also progressed, with ¥1,760 million paid to date. - FY2019-Q2AdvancedAnnual report
「The status of major capital projects and renovation plans that were under planning at the end of the previous consolidated fiscal year is as follows. Construction of a semiconductor manufacturing equipment production plant: 5,632; 2,219; February 2018; December 2018; 50%.」
Construction of the semiconductor manufacturing equipment production plant at the Hikone site was reported at a total cost of ¥5,632 million, with ¥2,219 million paid to date, scheduled completion in December 2018 and a 50% increase in capacity upon completion. Construction of a display manufacturing equipment and deposition equipment production plant was also reported at a total cost of ¥1,900 million, with ¥1,177 million paid to date, scheduled completion in October 2018 and a 30% increase in capacity. - FY2019-Q1Updated first-quarter capital investment resultsAnnual report
「Net cash used in investing activities was ¥6,180 million, compared with ¥839 million in the same period of the previous year, mainly because the company acquired property, plant and equipment, including R&D facilities.」
Net cash used in investing activities in the first quarter was ¥6,180 million, mainly because the company acquired property, plant and equipment, including R&D facilities. - FY2018-Q3AdvancedAnnual report
「To expand production capacity in the semiconductor equipment business, we plan to construct a new plant and renovate existing facilities at the Hikone site. Planned capital investment is ¥8.5 billion, funded with internal funds. The new plant is scheduled for completion in December 2018.」
In addition to the existing capital investment plan for the following year, the company specified plans to construct a new plant and renovate existing facilities at the Hikone site to expand production capacity in the semiconductor equipment business. Planned capital investment is ¥8.5 billion, with completion scheduled for December 2018. - FY2017First statedAnnual report
「The total capital investment plan for the one-year period following the current consolidated fiscal year is ¥10.5 billion, including intangible assets. The breakdown by segment is as follows.」
The capital investment plan for the following year totals ¥10.5 billion, including ¥6,055 million for SE research and development and production facilities, ¥1,744 million for GP-related investment and ¥634 million for FT-related investment, among other items.