Cmk (6958) · InitiativeAdvanced
Development of Circuit Boards for Wearables and Advanced Mobile Devices
First written in FY2016. 2 of 3 entries say "Advanced", first in FY2017. Latest entry: FY2018.
3entries
3years
0from disclosures
How it moved
Same theme, other companies
Expansion of Board Product Lineup from Cutting-Edge to General-Purpose ApplicationsA theme 5 companies write about · 0 as a headwind · 8 as a tailwind
2 other companies' latest entry also says "Advanced".
Ridges = years it wrote progress, valleys = years it wrote worse. Most hopeful companies at the back. Drag to turn, scroll to zoom, right-drag to pan. On a phone, two fingers turn and pinch to zoom; one finger scrolls the page.
Full recordFilings, disclosures and news, newest first
- FY2018AdvancedAnnual report
「③ We completed development and began mass production of rigid-flex boards and multilayer build-up boards for the advanced wearable information-device market, pursuing further reductions in thickness and feature size.」
For rigid-flex boards and multilayer build-up boards for advanced wearable information devices, development was completed and mass production began following reductions in thickness and feature size. - FY2017AdvancedAnnual report
「④ We completed development and began mass production of build-up boards and module boards for the advanced wearable information-device market, pursuing further reductions in thickness and feature size.」
For build-up boards and module boards for advanced wearable information devices, development was completed and mass production began following reductions in thickness and feature size. - FY2016First statedAnnual report
「For wearable devices, we are developing function-focused rigid-flex boards, high-heat-dissipation boards, and build-up boards.」
The company is developing rigid-flex, high-heat-dissipation, and build-up boards for wearable devices.