Start of Mass Production of High-Performance, Build-Up and Module Substrates

「先端向けビルドアップ配線板、多層プリント配線板が業績をけん引」

「In terms of profit, in addition to higher net sales, increased production of build-up boards (high-value-added boards) and improved productivity resulted in segment profit of ¥2,211 million, up 38.6% year on year.」

「Electrification requires high-heat-dissipation technologies to handle higher currents resulting from the installation of high-heat-generating components, including thicker conductors and high-thermal-conductivity resin materials, while also requiring high-density electronic circuits to enable advanced automated-driving control. We are pursuing the market needs of the rapidly developing electric vehicle market, including by proposing new technologies that combine high-current circuits with high-density wiring, and are advancing broad, customer-oriented research and development.」

「We are developing high-value-added boards for specific applications, including millimeter-wave modules, sensing cameras, high-speed automotive communications equipment, integrated ECUs, and EV inverters, and are advancing them toward mass production.」

「To meet these automotive needs, we are developing high-density multilayer build-up printed wiring boards for specific applications, including millimeter-wave modules, sensing cameras, automotive communications equipment, and integrated electronic-control ECUs.」

「We are developing high-density multilayer build-up printed wiring boards for millimeter-wave modules, sensing cameras, and automotive communications equipment, which are key components of ADAS and automated driving.」

「For multilayer build-up printed wiring boards for automotive communications equipment, we achieved greater wiring density and began mass production of new models.」

「For the advanced wearable information-device market, we completed development and began mass production of rigid-flex boards and multilayer build-up boards pursuing further reductions in thickness and feature size.」

「For the advanced wearable information-device market, we completed development and began mass production of build-up boards and module boards pursuing further reductions in thickness and feature size.」

「① For automotive applications and applications requiring high reliability, we completed development and began mass production of multilayer boards using organic materials with performance close to that of ceramic boards (LTCC), as well as high-function boards with improved reliability. ② We completed development and began mass production of build-up boards for advanced mobile devices. ③ For module boards, we achieved further reductions in thickness and feature size and began mass production.」