Development of ADAS and High-Reliability Automotive Circuit Boards
First written in FY2016. 9 of 10 entries say "Advanced", first in FY2017. Latest entry: 2026-08-05.
No other company in this theme has enough history to compare yet.
- 2026-08-05AdvancedEarnings presentation
「また、ADASや統合ECUなどの高付加価値品の増加が連結営業利益に寄与し始めており、2Q以降は連結営業利益の改善を見込む」
ADAS・統合ECUなどの高信頼性車載製品が、開発・提案段階から連結営業利益への寄与段階へ進んだと記載された。 - FY2025AdvancedAnnual report
「For boards used in millimeter-wave modules, in particular, we are developing new materials and structures that combine high-frequency performance with dimensional stability and seeking to establish them as mass-production technologies. In addition, by developing combined technologies including thick-copper wiring for high-current circuits, the use of high-heat-dissipation materials, and high-density wiring, we are strengthening product proposals that contribute to higher EV output and more sophisticated control circuits.」
Development of EV- and ADAS-related products combining new materials and structures for millimeter-wave module boards, thick-copper wiring, high-heat-dissipation materials, and high-density wiring progressed to the establishment of mass-production technologies and the product-proposal stage. - FY2024AdvancedAnnual report
「In the automotive market, our Group's core product area, we are developing high-value-added products including millimeter-wave radar and ADAS cameras for automated driving, high-speed automotive communications equipment, integrated electronic-control ECUs, and high-output device modules. For boards used in millimeter-wave modules, we are advancing the mass production of new materials and structures to improve high-frequency performance.」
The development scope was expanded to ADAS, millimeter-wave radar, automotive communications, integrated ECUs, and high-output modules, with mass production of new materials and structures being advanced. - FY2023AdvancedAnnual report
「To meet these automotive needs, we are developing high-value-added boards for specific applications, including millimeter-wave modules, sensing cameras, high-speed automotive communications equipment, integrated ECUs, and EV inverters, and are advancing them toward mass production.」
The development scope was expanded beyond conventional ADAS and millimeter-wave applications to boards for high-speed automotive communications equipment, integrated ECUs, and EV inverters, with progress toward mass production. - FY2022AdvancedAnnual report
「Specific research and development activities in the 62nd fiscal year were as follows: ① Began prototyping wiring boards for next-generation millimeter-wave modules for ADAS applications.」
Development of ADAS millimeter-wave module wiring boards progressed from mass production of conventional products to the start of prototyping next-generation models. - FY2021AdvancedAnnual report
「Development began on printed wiring boards for next-generation millimeter-wave modules for ADAS applications.」
In addition to its mass-production track record for conventional millimeter-wave radar boards and other products, the company began developing boards for next-generation millimeter-wave modules. - FY2019AdvancedAnnual report
「For sensor-related products serving as a key element of advanced driver assistance systems (ADAS), we completed development and began mass production of high-reliability rigid-flex printed wiring boards for automotive camera modules.」
Development of high-reliability rigid-flex printed wiring boards for automotive camera modules used in ADAS progressed from completion to the start of mass production. - FY2018AdvancedAnnual report
「① We completed development and began mass production of high-precision sensor boards for millimeter-wave radar, a key technology for advanced driver assistance systems (ADAS). ② As a thermal-management solution for automotive applications, we developed high-heat-dissipation boards featuring copper pins with high thermal conductivity embedded within the boards and began shipping prototypes.」
The company reported specific progress in development, with development completed and mass production begun for ADAS millimeter-wave radar boards, and prototype shipments begun for high-heat-dissipation boards. - FY2017AdvancedAnnual report
「① We completed development and began mass production of high-precision sensor boards for millimeter-wave radar, a key technology for advanced driver assistance systems (ADAS). ② As an alternative to ceramic boards (inorganic materials) for automotive applications, we completed development and began mass production of high-reliability boards using organic materials. ③ As a thermal-management solution for automotive applications, we developed high-heat-dissipation boards featuring copper pins with high thermal conductivity embedded within the boards and began shipping prototypes.」
Development was completed and mass production began for the ADAS millimeter-wave radar boards and high-reliability boards, while prototype shipments began for the high-heat-dissipation boards. - FY2016First statedAnnual report
「To meet these market needs, we are developing automotive printed wiring boards including millimeter-wave boards for automotive applications (supporting the 24–79 GHz high-frequency band), automotive camera-module boards, high-heat-resistance, high-reliability boards, high-voltage and high-current boards, and environmentally friendly boards. For wearable devices, we are developing function-focused rigid-flex boards, high-heat-dissipation boards, and build-up boards.」
For automotive applications, the company is developing millimeter-wave, high-heat-resistance, high-reliability, high-voltage and high-current, and environmentally friendly boards.