Growth driven by semiconductor and electronic component manufacturing equipment
First written in FY2016. 22 of 37 entries say "Advanced", first in FY2017-Q1. Latest entry: FY2026.
3 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Logic, memory and advanced packaging performed strongly, and orders exceeded the year-earlier period. However, sales fell below the year-earlier period owing to an adjustment in power device investment in Japan and China.」
In semiconductor and electronic component manufacturing equipment, logic, memory and advanced packaging drove orders, while the adjustment in power device investment affected sales. - FY2026-H1AdvancedAnnual report
「In semiconductor and electronic component manufacturing equipment, order intake exceeded the previous-year period because the logic, memory and advanced packaging fields remained strong. However, revenue fell below the previous-year period due to the decline following the investment peak in power devices in Japan and China.」
Orders exceeded the year-earlier period on strong performance in logic, memory and advanced packaging, while sales fell below it owing to a pullback in power device investment. - FY2025RaisedAnnual report
「In the semiconductor manufacturing equipment business, the company aims to increase the number of PORs (Process of Record: qualified processes used in mass production) among key customers and expand its market share by securing new process applications, building on its proven hard-mask and metal deposition technologies. It is targeting orders of at least ¥100 billion in the fiscal year ending June 2031.」
The company identified semiconductor manufacturing equipment as a growth area and set specific targets of increasing PORs, securing new process applications, and achieving orders of at least ¥100 billion in the fiscal year ending June 2031. - FY2025-H1Orders declined on the pullback in power device investment, while sales increased on semiconductor contributionsAnnual report
「Orders of semiconductor and electronic component manufacturing equipment fell below the year-earlier period owing to a pullback in power device investment in Japan and China, while sales exceeded the year-earlier period on contributions from semiconductors and other factors.」
Orders fell below the year-earlier period owing to a pullback in power device investment in Japan and China, while sales exceeded it on contributions from semiconductors and other factors. - FY2024AdvancedAnnual report
「Orders and sales of semiconductor manufacturing equipment both exceeded the year-earlier period as investment in advanced logic and memory recovered from the second half of the fiscal year, while investment in power devices for electronic component manufacturing equipment gained momentum.」
Advanced logic and memory investment recovered from the second half, while power device investment also gained momentum, resulting in orders and sales of semiconductor and electronic component manufacturing equipment both exceeding the year-earlier period. - FY2024-Q3AdvancedAnnual report
「Orders and sales of semiconductor and electronic component manufacturing equipment both exceeded the year-earlier period, supported by a recovery in advanced logic and memory investment from the adjustment phase toward the second half, as well as stronger power device investment in Japan and China.」
Advanced logic and memory investment recovered from the adjustment phase toward the second half, while power device investment also gained momentum in Japan and China, resulting in orders and sales of semiconductor and electronic component manufacturing equipment both exceeding the year-earlier period. - FY2024-Q2Orders declined due to restrained memory investment, while sales increased on power device demandAnnual report
「Orders of semiconductor and electronic component manufacturing equipment fell below the year-earlier period, partly because restraint in semiconductor investment, including memory, continued. However, power device investment gained momentum in Japan and China, and sales exceeded the year-earlier period.」
Orders fell below the year-earlier period because restraint in semiconductor investment, including memory, continued, while sales exceeded it owing to stronger power device investment in Japan and China. - FY2024-Q1Memory investment remained restrained, while power device investment gained momentumAnnual report
「Semiconductor and electronic component manufacturing equipment saw continued restraint in semiconductor investment, including memory, while power device investment gained momentum in Japan and China. Orders were roughly level with the year-earlier period, while sales exceeded it.」
While restraint in semiconductor investment, including memory, continued, power device investment gained momentum in Japan and China. Orders were roughly level with the year-earlier period, while sales exceeded it. - FY2023-Q3RestatedAnnual report
「Semiconductor and electronic component manufacturing equipment exceeded the year-earlier period in both orders and sales, owing to the contribution of investment in logic, increased investment in power devices and optoelectronic devices, and increased investment related to the localization of electronics production in China.」
Orders and sales continued to exceed the year-earlier period, supported by investment in logic, power and optoelectronic devices, and the localization of electronics production in China. - FY2023-Q2AdvancedAnnual report
「Semiconductor and electronic component manufacturing equipment exceeded the year-earlier period in both orders and sales, owing to the contribution of investment in logic, increased investment in power devices and optoelectronic devices, and increased investment related to the localization of electronics production in China.」
Against a backdrop of investment in logic, power and optoelectronic devices, and the localization of electronics production in China, orders and sales of semiconductor and electronic component manufacturing equipment both exceeded the year-earlier period. - FY2022AdvancedAnnual report
「Semiconductor manufacturing equipment exceeded the year-earlier period in both orders and sales, driven by continued memory investment and increased investment in logic. Electronic component manufacturing equipment also exceeded the year-earlier period in both orders and sales, supported by increased investment in power devices, optoelectronic devices and sensors, as well as more active business discussions related to the localization of electronics production in China.」
Orders and sales of semiconductor and electronic component manufacturing equipment both exceeded the year-earlier period, driven by memory, logic, power, optoelectronics, sensors and China-related electronics localization. - FY2022-Q3RestatedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and sensors, as well as increased business discussions related to the localization of electronics production in China.」
Orders and revenue for semiconductor and electronic-component manufacturing equipment remained above the levels of the same period of the previous year, supported by memory and logic investment, investment in various devices and business discussions related to localization in China. - FY2022-Q2RestatedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and sensors, as well as increased business discussions related to the localization of electronics production in China.」
Against a backdrop of continued investment in memory, investment in logic, investment in various devices and business discussions related to the localization of electronics production in China, orders and revenue for semiconductor and electronic-component manufacturing equipment both exceeded the levels of the same period of the previous year. - FY2022-Q1AdvancedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and increased business discussions related to the localization of electronics production in China.」
Against a backdrop of continued investment in memory, investment in logic, investment in power, optoelectronic and communications devices, and business discussions related to localization in China, orders and revenue for semiconductor and electronic-component manufacturing equipment both exceeded the levels of the same period of the previous year. - FY2021AdvancedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to the resumption of memory investment and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, supported by increased investment in power, optoelectronic and communications devices and increased business discussions related to the localization of electronics production in China.」
For semiconductor manufacturing equipment, the resumption of memory investment and increased investment in logic contributed to results. For electronic-component manufacturing equipment, investment in power, optoelectronic and communications devices and business discussions related to localization in China contributed to orders and revenue both exceeding the levels of the same period of the previous year. - FY2021-Q3RestatedAnnual report
「Orders and revenue in the semiconductor and electronic-component businesses exceeded the levels of the same period of the previous year, driven by the resumption of memory investment, increased investment in power and optoelectronic devices, and increased business discussions related to the localization of electronics production in China.」
Orders and revenue in the semiconductor and electronic-component businesses exceeded the levels of the same period of the previous year, driven by the resumption of memory investment, investment in power and optoelectronic devices, and business discussions related to the localization of electronics production in China. - FY2021-Q2AdvancedAnnual report
「In the semiconductor business, both memory- and logic-related products remained firm. In the electronic-component business, investment in power devices and optoelectronic devices became more active, and business discussions related to the localization of electronics production in China also increased, resulting in orders and revenue above the levels of the same period of the previous year.」
In semiconductors, both memory- and logic-related products remained firm. In electronic components, power devices, optoelectronic devices and business discussions related to the localization of electronics production in China contributed to orders and revenue exceeding the levels of the same period of the previous year. - FY2020AdvancedAnnual report
「Investment in memory-related equipment, including sputtering equipment and native oxide removal equipment for DRAM and NAND flash memory, was in an adjustment phase, but began to recover, particularly for DRAM, from around the end of 2019. Sputtering equipment for logic and other products also contributed, and orders exceeded the level of the same period of the previous year.」
Despite the adjustment in memory-related investment, semiconductor-related orders exceeded the level of the same period of the previous year, supported by the recovery trend in DRAM and contributions from sputtering equipment for logic. - FY2020-Q2RestatedAnnual report
「Investment in memory-related equipment, including sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory, was in an adjustment phase, but sputtering equipment for logic and other products contributed to orders exceeding the level of the same period of the previous year. In the electronic-component business, manufacturing equipment for communications devices and power devices remained firm.」
While memory-related investment was in an adjustment phase, semiconductor-related orders exceeded the level of the same period of the previous year due to contributions from logic equipment. Equipment for communications devices and power devices also remained firm. - FY2020-Q1Semiconductor revenue was weak, while logic orders increased and electronic components remained firmAnnual report
「In the semiconductor business, revenue from sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory was weak due to the recent slowdown in memory-related investment. However, orders exceeded the level of the same period of the previous year, supported by sputtering equipment for logic and other products. In the electronic-component business, manufacturing equipment for communications devices and power semiconductors remained firm.」
Revenue from memory-related equipment was weak, while orders exceeded the level of the same period of the previous year due to contributions from logic equipment. Equipment for communications devices and power semiconductors remained firm. - FY2019FPD and semiconductors were weak, while electronic components and components remained firmAnnual report
「FPD manufacturing equipment orders were recorded for large LCD manufacturing equipment for televisions, mainly in China, and OLED manufacturing equipment for smartphones, but both orders and revenue were lower than in the same period of the previous year. In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory were affected by the recent slowdown in memory-related investment, resulting in lower orders and revenue than in the same period of the previous year. In the electronic-component business, equipment for high-performance devices for mobile devices and power semiconductors remained firm.」
Orders and revenue for FPD and semiconductor-related equipment were lower than in the same period of the previous year due to the slowdown in investment, while the electronic-component business remained firm. - FY2019-Q3Orders and revenue were weak as memory investment slowed, while electronic components remained firmAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory were affected by the recent slowdown in memory-related investment, resulting in weak orders and revenue compared with the same period of the previous year. In the electronic-component business, equipment for high-performance devices for mobile devices and power semiconductors remained firm.」
In the semiconductor business, orders and revenue were weak year on year due to the slowdown in memory-related investment. In contrast, the electronic-component business remained firm, supported by high-performance devices and power semiconductor equipment. - FY2019-Q2Orders declined and revenue was flat year on year as memory investment slowedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory, as well as sputtering equipment for logic, contributed to revenue. In the electronic-component business, equipment for high-performance devices for mobile devices and power semiconductors also increased, resulting in revenue roughly level with that of the same period of the previous year. Orders, however, were lower than in the same period of the previous year due to a recent slowdown in memory-related investment.」
Revenue from semiconductor and electronic-component manufacturing equipment remained roughly level with that of the same period of the previous year, while orders were lower due to the slowdown in memory-related investment. - FY2019-Q1AdvancedAnnual report
「In the semiconductor business, orders increased with contributions from sputtering equipment for logic in addition to sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory. In the electronic-component business, equipment for high-performance devices and power semiconductors increased, resulting in orders and revenue above the levels of the same period of the previous year.」
In addition to memory, sputtering equipment for logic contributed to orders, while equipment for high-performance devices and power semiconductors increased in the electronic-component business. Both orders and revenue for semiconductor and electronic-component manufacturing equipment exceeded the levels of the same period of the previous year. - FY2018AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue substantially above the levels of the same period of the previous year.」
Orders and revenue for equipment for NAND, DRAM and next-generation nonvolatile memory, as well as equipment for high-performance electronic devices, substantially exceeded the levels of the same period of the previous year. - FY2018AdvancedAnnual report
「① Growth in the semiconductor business through both memory and logic ② Growth in the electronic-equipment business by turning technological innovation accelerated by 5G into a business opportunity」
Growth in the semiconductor business was explicitly positioned around both memory and logic, while technological innovation driven by 5G was identified as a specific growth opportunity in the electronic-equipment business. - FY2018-Q3AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory and next-generation nonvolatile memory increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue substantially above the levels of the same period of the previous year.」
Orders and revenue for equipment for NAND flash memory and next-generation nonvolatile memory, as well as high-performance device manufacturing equipment, substantially exceeded the levels of the same period of the previous year. - FY2018-Q2AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory and next-generation nonvolatile memory increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue substantially above the levels of the same period of the previous year.」
Orders and revenue for equipment for semiconductor memory and high-performance device manufacturing equipment for mobile devices substantially exceeded the levels of the same period of the previous year. - FY2018-Q1AdvancedAnnual report
「FPD manufacturing equipment orders and revenue both substantially exceeded the levels of the same period of the previous year, driven by increases in large LCD manufacturing equipment for televisions, mainly in China, and small- and medium-sized OLED manufacturing equipment for smartphones. In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Large LCD equipment, mainly for televisions in China, small- and medium-sized OLED equipment, semiconductor equipment for memory, and high-performance electronic-device equipment contributed to orders and revenue exceeding the levels of the same period of the previous year. - FY2017AdvancedAnnual report
「Orders for FPD manufacturing equipment exceeded the level of the same period of the previous year, despite a decline in equipment for small- and medium-sized LCD displays, as OLED manufacturing equipment and large LCD manufacturing equipment for televisions remained at high levels. Revenue substantially exceeded the level of the same period of the previous year, supported by increases in OLED manufacturing equipment and large LCD manufacturing equipment for televisions.」
For the full year, key growth areas including OLED and large LCD displays, semiconductors and electronic components, and components drove performance. - FY2017-Q3RestatedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Orders and revenue for semiconductor and electronic-component manufacturing equipment exceeded the levels of the same period of the previous year, driven by increased investment in memory, as stated for the second consecutive quarter. - FY2017-Q2AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Orders and revenue for specific equipment in semiconductor and electronic-component manufacturing equipment exceeded the levels of the same period of the previous year, driven by increased investment in memory. - FY2017-Q1AdvancedAnnual report
「Orders for semiconductor-related products, centered on sputtering equipment and native oxide removal equipment for memory, and orders for electronic-component-related products, centered on high-performance device manufacturing equipment for mobile devices, exceeded the levels of the same period of the previous year. Revenue, however, was lower than in the same period of the previous year.」
Orders for specific product groups in semiconductor and electronic-component manufacturing equipment exceeded the levels of the same period of the previous year, while revenue was lower. - FY2016First statedAnnual report
「The business portfolio is expected to be driven by growth in semiconductor and electronic-component manufacturing equipment, while FPD and PV manufacturing equipment, general industrial equipment and components continue to provide a stable base.」
A business portfolio in which existing businesses provide the base and semiconductor and electronic-component manufacturing equipment serves as the growth driver.