Development of Equipment for Next-Generation Nonvolatile Memory and High-Performance Electronic Devices
First written in FY2016. 18 of 34 entries say "Advanced", first in FY2017-Q1. Latest entry: FY2026.
6 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「In semiconductor manufacturing equipment, we are developing equipment and deposition processes with improved performance to enter additional process steps, building on our track record in metal hard mask processes for leading-edge logic. In the memory field, we are also advancing equipment and deposition-process development aimed at entering additional process steps for DRAM and 3D NAND flash memory, where finer geometries and higher layer counts are progressing. These efforts led to the development of the new ENTRON-EXX model.」
The company explained that efforts to enter additional process steps beyond metal hard mask processes in leading-edge logic, together with development for DRAM and 3D NAND, led to the new ENTRON-EXX model. - FY2026-H1AdvancedAnnual report
「In semiconductor and electronic component manufacturing equipment, order intake exceeded the previous-year period because the logic, memory and advanced packaging fields remained strong. However, revenue fell below the previous-year period due to the decline following the investment peak in power devices in Japan and China.」
Orders for semiconductor and electronic component manufacturing equipment in the logic, memory and advanced packaging fields exceeded the year-earlier period, while the pullback in power-device investment affected revenue. - FY2025AdvancedAnnual report
「We began accepting orders for the new ENTRON-EXX model. The equipment has enhanced data collection and analysis capabilities to meet the needs of increasingly advanced and complex semiconductor manufacturing processes. It also features a highly scalable design that enables factory space to be used more efficiently.」
The company began accepting orders for the new ENTRON-EXX semiconductor manufacturing equipment model and advanced the launch of a product with enhanced data collection, analysis capabilities and scalability. - FY2025-H1Orders declined on the pullback in power device investment, while sales increased on semiconductor contributionsAnnual report
「Orders of semiconductor and electronic component manufacturing equipment fell below the year-earlier period owing to a pullback in power device investment in Japan and China, while sales exceeded the year-earlier period on contributions from semiconductors and other factors.」
Orders for semiconductor and electronic component manufacturing equipment declined following a pullback in power-device investment, while semiconductor-related products contributed to revenue. - FY2024AdvancedAnnual report
「In semiconductor manufacturing equipment, we are developing equipment and deposition processes with improved performance to enter additional process steps, building on our track record in metal hard mask processes for leading-edge logic. In the memory field, we are also advancing equipment and deposition-process development aimed at entering additional process steps for DRAM and 3D NAND flash memory, where finer geometries and higher layer counts are progressing.」
Development aimed at expanding from metal hard mask processes into other process steps in leading-edge logic, as well as equipment and deposition-process development for DRAM and 3D NAND aimed at entering additional process steps, was highlighted. - FY2024-Q3AdvancedAnnual report
「Orders and sales of semiconductor and electronic component manufacturing equipment both exceeded the year-earlier period, supported by a recovery in advanced logic and memory investment from the adjustment phase toward the second half, as well as stronger power device investment in Japan and China.」
Against a backdrop of recovering investment in advanced logic and memory and more active power-device investment in Japan and China, both orders and revenue for the relevant equipment exceeded the year-earlier period. - FY2024-Q2Orders declined due to restrained memory investment, while sales increased on power device demandAnnual report
「Orders of semiconductor and electronic component manufacturing equipment fell below the year-earlier period, partly because restraint in semiconductor investment, including memory, continued. However, power device investment gained momentum in Japan and China, and sales exceeded the year-earlier period.」
Orders fell below the year-earlier period because restraint in semiconductor investment, including memory, continued, while sales exceeded it owing to stronger power device investment in Japan and China. - FY2024-Q1Memory investment remained restrained, while power device investment gained momentumAnnual report
「Semiconductor and electronic component manufacturing equipment saw continued restraint in semiconductor investment, including memory, while power device investment gained momentum in Japan and China. Orders were roughly level with the year-earlier period, while sales exceeded it.」
While restraint in semiconductor investment, including memory, continued, investment in power devices in Japan and China became more active, driving revenue from semiconductor and electronic component manufacturing equipment above the year-earlier period. - FY2023-Q3RestatedAnnual report
「Semiconductor and electronic component manufacturing equipment exceeded the year-earlier period in both orders and sales, owing to the contribution of investment in logic, increased investment in power devices and optoelectronic devices, and increased investment related to the localization of electronics production in China.」
Investment in logic, power optoelectronics and the localization of electronics production in China continued to contribute to orders and revenue exceeding the year-earlier period. - FY2023-Q2AdvancedAnnual report
「Semiconductor and electronic component manufacturing equipment exceeded the year-earlier period in both orders and sales, owing to the contribution of investment in logic, increased investment in power devices and optoelectronic devices, and increased investment related to the localization of electronics production in China.」
Against a backdrop of investment in logic applications, power and optoelectronic devices, and electronics localization in China, order intake and sales for the relevant equipment exceeded the year-earlier period. - FY2022AdvancedAnnual report
「Specifically, the company developed and released the IM-2000 ion milling system for sub-nanometer planarization for 5G devices, the ULDiS series of sputtering systems for optical films, and an anti-reflective film deposition system compatible with 3D automotive cover glass. It also developed and released a new etching module for the uGmni series of single-wafer, multi-module deposition and processing systems for electronic component manufacturing, as well as the SEGul GaN epitaxial growth module using sputtering.」
The company developed and released specific equipment and modules for 5G, optical films, automotive cover glass, electronic components and GaN. - FY2022-Q3RestatedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and sensors, as well as increased business discussions related to the localization of electronics production in China.」
Equipment for memory and logic applications, equipment for various electronic devices, and China-related localization projects contributed to order intake and sales continuing to exceed the year-earlier period. - FY2022-Q2RestatedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and sensors, as well as increased business discussions related to the localization of electronics production in China.」
In addition to equipment for memory and logic applications, equipment for power, optoelectronic, communications and sensor applications, as well as China-related localization projects, contributed to order intake and sales continuing to exceed the year-earlier period. - FY2022-Q1AdvancedAnnual report
「Orders and revenue for semiconductor manufacturing equipment exceeded the levels of the same period of the previous year due to continued investment in memory and increased investment in logic. Orders and revenue for electronic-component manufacturing equipment also exceeded the levels of the same period of the previous year, driven by increased investment in power, optoelectronic and communications devices and increased business discussions related to the localization of electronics production in China.」
In addition to equipment for memory and logic applications, equipment for power, optoelectronic and communications devices, along with electronics localization projects in China, contributed to both order intake and sales exceeding the year-earlier period. - FY2021AdvancedAnnual report
「The company is also developing equipment and processes for the advanced logic segment, where significant market expansion is expected, as well as equipment, processes and materials tailored to market requirements in the nonvolatile memory field, and is bringing them to market.」
In addition to conventional equipment development for memory applications, development was indicated of equipment and processes for the advanced logic segment and equipment, processes and materials for nonvolatile memory applications, together with their market launch. - FY2021-Q3RestatedAnnual report
「Orders and revenue in the semiconductor and electronic-component businesses exceeded the levels of the same period of the previous year, driven by the resumption of memory investment, increased investment in power and optoelectronic devices, and increased business discussions related to the localization of electronics production in China.」
Against a backdrop of resumed memory investment, investment in power and optoelectronic devices, and electronics localization projects in China, order intake and sales for the relevant equipment exceeded the year-earlier period. - FY2021-Q2AdvancedAnnual report
「In the semiconductor business, both memory- and logic-related products remained firm. In the electronic-component business, investment in power devices and optoelectronic devices became more active, and business discussions related to the localization of electronics production in China also increased, resulting in orders and revenue above the levels of the same period of the previous year.」
From the decline in orders and sales caused by the transition period in the previous quarter, both memory and logic applications performed steadily, and order intake and sales in the semiconductor and electronic components-related businesses exceeded the year-earlier period. - FY2021-Q1Orders and sales decline during an investment transition period for memory and logicAnnual report
「Although order intake for both memory and logic applications is expected to be approximately in line with the year-earlier period for the fiscal year, the current quarter was a temporary transition period, and both order intake and sales fell below the year-earlier period. In the electronic components-related business, investment activity in China was increasing, but both order intake and sales fell below the year-earlier period, partly due to the impact of travel restrictions.」
Order intake and sales for semiconductor-related products for memory and logic applications fell below the year-earlier period due to a temporary transition period, while the electronic components-related business also declined because of travel restrictions. - FY2020Logic contributed to orders amid memory investment adjustmentAnnual report
「In the semiconductor-related business, memory-related investment, including sputtering equipment and native-oxide removal equipment for DRAM and NAND flash memory, was undergoing adjustment, but began to recover, led by DRAM, around the end of 2019. Sputtering equipment for logic applications also contributed, and order intake exceeded the year-earlier period. In the electronic components-related business, manufacturing equipment for communications devices and power devices performed steadily.」
While adjustment in memory-related investment continued, the recovery in DRAM and equipment for logic applications contributed to orders, and equipment for communications devices and power devices also performed steadily. - FY2020-Q2RestatedAnnual report
「Investment in memory-related equipment, including sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory, was in an adjustment phase, but sputtering equipment for logic and other products contributed to orders exceeding the level of the same period of the previous year. In the electronic-component business, manufacturing equipment for communications devices and power devices remained firm.」
While adjustment in memory-related investment continued, equipment for logic applications contributed to orders, and equipment for communications devices and power devices performed steadily. - FY2020-Q1Memory-related sales weak, but logic orders increase and electronic components remain steadyAnnual report
「In the semiconductor business, revenue from sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory was weak due to the recent slowdown in memory-related investment. However, orders exceeded the level of the same period of the previous year, supported by sputtering equipment for logic and other products. In the electronic-component business, manufacturing equipment for communications devices and power semiconductors remained firm.」
Sales of memory-related products were weak due to slower memory-related investment, but equipment for logic applications contributed to orders, while equipment for communications devices and power semiconductors performed steadily. - FY2019Orders and revenue were weak as memory investment slowed, while electronic components remained firmAnnual report
「In the semiconductor-related business, order intake and sales both fell below the year-earlier period for sputtering equipment and native-oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory, reflecting the recent slowdown in memory-related investment. In the electronic components-related business, manufacturing equipment for high-performance devices for mobile devices and power semiconductors performed steadily.」
Order intake and sales for equipment for memory and next-generation nonvolatile memory applications declined due to slower investment, while equipment for high-performance devices and power semiconductors performed steadily. - FY2019-Q3Orders and revenue were weak as memory investment slowed, while electronic components remained firmAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory were affected by the recent slowdown in memory-related investment, resulting in weak orders and revenue compared with the same period of the previous year. In the electronic-component business, equipment for high-performance devices for mobile devices and power semiconductors remained firm.」
Equipment for memory and next-generation nonvolatile memory applications saw weak orders and sales due to slower memory-related investment. Equipment for high-performance devices and power semiconductors related to electronic components performed steadily. - FY2019-Q2Memory investment slows; orders decline while sales remain flatAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory, as well as sputtering equipment for logic, contributed to revenue. In the electronic-component business, equipment for high-performance devices for mobile devices and power semiconductors also increased, resulting in revenue roughly level with that of the same period of the previous year. Orders, however, were lower than in the same period of the previous year due to a recent slowdown in memory-related investment.」
Products for memory, logic, electronic components and power semiconductors contributed to sales, but order intake fell below the year-earlier period due to slower investment related to memory. - FY2019-Q1AdvancedAnnual report
「In the semiconductor business, orders increased with contributions from sputtering equipment for logic in addition to sputtering equipment and native oxide removal equipment for NAND flash memory, DRAM and next-generation nonvolatile memory. In the electronic-component business, equipment for high-performance devices and power semiconductors increased, resulting in orders and revenue above the levels of the same period of the previous year.」
The company reported contributions to and increases in orders for equipment for NAND, DRAM and next-generation nonvolatile memory, as well as sputtering equipment for logic applications and manufacturing equipment for power semiconductors. - FY2018AdvancedAnnual report
「While improving the performance of equipment for DRAM and 3D NAND flash memory processes, the company is developing and bringing to market modules tailored to market requirements for manufacturing equipment for next-generation nonvolatile memory and logic applications.」
In addition to improving the performance of equipment for DRAM and 3D NAND, development and market launch of modules for next-generation nonvolatile memory and logic applications were indicated. - FY2018-Q3AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory and next-generation nonvolatile memory increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue substantially above the levels of the same period of the previous year.」
Order intake and sales significantly exceeded the year-earlier period for equipment for NAND flash memory and next-generation nonvolatile memory, as well as high-performance device manufacturing equipment for mobile devices. - FY2018-Q2AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment for NAND flash memory and next-generation nonvolatile memory increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue substantially above the levels of the same period of the previous year.」
Orders and revenue for equipment for NAND flash memory and next-generation nonvolatile memory, as well as high-performance device manufacturing equipment, substantially exceeded the levels of the same period of the previous year. - FY2018-Q1AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Order intake and sales continued to exceed the year-earlier period for sputtering equipment and native-oxide removal equipment for memory applications, and high-performance device manufacturing equipment for mobile devices. - FY2017AdvancedAnnual report
「In high-density packaging, the company developed and began selling the NA-1500 etching system for PLP (Panel Level Packaging), which expands the processing area and significantly improves productivity. For power devices, it also developed and began selling the SOPHI-30 low-acceleration, high-dose ion implanter for IGBT applications and the SOPHI-400 high-acceleration ion implanter, substantially expanding its lineup of ion implantation equipment for power devices together with existing models.」
The product lineup expanded with the development and launch of an etching system for PLP and 2 new models for power devices. - FY2017-Q3RestatedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Order intake and sales for sputtering equipment and native-oxide removal equipment for memory applications, as well as manufacturing equipment for high-performance devices, continued to exceed the year-earlier period. - FY2017-Q2AdvancedAnnual report
「In the semiconductor business, sputtering equipment and native oxide removal equipment increased with the expansion of investment in memory. In the electronic-component business, high-performance device manufacturing equipment for mobile devices and other products remained firm, resulting in orders and revenue above the levels of the same period of the previous year.」
Order intake and sales for sputtering equipment and native-oxide removal equipment for memory applications, as well as manufacturing equipment for high-performance devices, exceeded the year-earlier period. - FY2017-Q1AdvancedAnnual report
「Orders for semiconductor-related products, centered on sputtering equipment and native oxide removal equipment for memory, and orders for electronic-component-related products, centered on high-performance device manufacturing equipment for mobile devices, exceeded the levels of the same period of the previous year. Revenue, however, was lower than in the same period of the previous year.」
Order intake for memory-related equipment and equipment for high-performance electronic devices exceeded the year-earlier period, although sales fell below the year-earlier period. - FY2016First statedAnnual report
「For manufacturing equipment for next-generation nonvolatile memory following 3D NAND flash memory, the company is developing and bringing to market modules that improve film-forming performance and enable new processes.」
Equipment for high-density packaging, MEMS and power semiconductors has also been brought to market.