Creating New Markets and New Businesses Through the Application of Core Technologies
First written in FY2017-Q1. 11 of 18 entries say "Advanced", first in FY2018. Latest entry: FY2026.
2 other companies' latest entry also says "Restated".
- FY2026RestatedAnnual report
「③ Create new markets by leveraging our core competencies※」
We continue to pursue a policy of creating new markets by leveraging our core competencies, as a basic policy of the Second Medium-Term Management Plan. - 2026-05-11AdvancedResults
「シンギュレーション装置の売上高が大きく伸長したことにより、売上高は498億70百万円(前連結会計年度比9億11百万円、1.9%増)となりました。」
コア技術の応用展開に含まれるシンギュレーション装置について、売上高の伸長を実績として示した。 - FY2025AdvancedAnnual report
「③ Create new markets by leveraging our core competencies※」
The company explicitly identified the creation of new markets by leveraging its core competencies as a basic policy of the Second Medium-Term Management Plan. - FY2024-Q1AdvancedAnnual report
「Against this backdrop, we decided to acquire the mold manufacturing business of K-Tool Engineering Sdn. Bhd. to achieve further business development and expansion through cooperation between our semiconductor manufacturing equipment and mold manufacturing businesses.」
To expand the business by linking our core technologies and semiconductor manufacturing equipment business with the mold manufacturing business, we implemented the specific measure of acquiring a mold manufacturing business in Malaysia. - FY2022AdvancedAnnual report
「We also expanded revenue opportunities outside our main molding equipment business by making Fine International Co., Ltd. a subsidiary through a share acquisition. Fine International manufactures and sells blades, consumable parts for singulation equipment, and changed its name to TOWA Fine Co., Ltd. on 30 March 2022. We also completed a new building at the Kyoto East Facility to increase production capacity for expanding our cutting-tool and contract-processing businesses.」
We expanded revenue opportunities through the application of our core technologies by making the blade manufacturer a subsidiary, completing a new building at the Kyoto East Facility, and increasing production capacity for cutting tools and contract processing. - FY2021AdvancedAnnual report
「▶ Establish new businesses that can become new pillars through the application and development of our core technologies and transform our portfolio ▶ Launch TOWA original products ▶ Expand business opportunities through the global development of Total Solution Service (TSS), the modification business and other operations」
The company organized the application and development of core technologies, the launch of new products, and the global expansion of the TSS and modification businesses as specific measures to establish new earnings pillars and transform its portfolio. - FY2020-Q3AdvancedAnnual report
「As a leading company in semiconductor molding equipment, we provided the market with various solutions, including shipping the industry’s first full-scale mass-production equipment for ultra-large-panel PLP, an advanced packaging technology.」
The company presented a specific development in creating new markets and businesses through the application and development of its core technologies: the initial shipment of a mass-production machine for ultra-large-panel PLP. - FY2020-Q2AdvancedAnnual report
「We pursued business development aimed at establishing a stable earnings structure. For example, revenue from contract processing applying our core ultra-precision machining technology during the six months ended 30 September exceeded the full-year result for the previous year, April 2018 to March 2019.」
It states that cumulative sales from contract processing using ultra-precision machining technology for the second quarter exceeded the previous full-year result. - FY2020-Q1RestatedAnnual report
「We actively pursued new businesses to put businesses applying and developing core technologies such as ultra-precision and precision machining and coating technologies on a growth trajectory and establish a stable earnings structure less affected by semiconductor market conditions.」
We continue to pursue a policy of growing new businesses that apply our core technologies and establishing a stable earnings structure less affected by semiconductor market conditions. - FY2019AdvancedAnnual report
「The modification business of TOWA Korea Co., Ltd., which we acquired from a group company of Samsung Electronics of Korea in 2016, grew substantially, with sales approximately doubling and operating profit increasing approximately fourfold compared with the time of acquisition. We will continue to make active investments to further expand the scale of the business. In new businesses, we began developing a laser processing equipment business through the acquisition of shares in OMRON Laserfront Co., Ltd. in August 2018.」
The TSS modification business achieved sales of approximately twice and operating profit of approximately four times the levels at acquisition, and the laser processing equipment business was added as a new business. - FY2019-Q3AdvancedAnnual report
「In China, our group operates TOWA Semiconductor Equipment (Suzhou) Co., Ltd. as a manufacturing base for semiconductor manufacturing equipment and Towa Semiconductor Equipment (Shanghai) Co., Ltd. as a sales base. China is currently making active economic development investments as part of its national policy to foster the semiconductor industry, and demand for semiconductor manufacturing equipment is rising above previous levels. Against this backdrop, we decided to acquire the mold manufacturing business of 精技電子(南通)有限公司 in order to achieve further business development and expansion through cooperation between our semiconductor manufacturing equipment and mold manufacturing businesses.」
As a specific measure to link our semiconductor manufacturing equipment and mold manufacturing businesses in China, we acquired a mold manufacturing business and pursued business expansion through the application and development of our core technologies. - FY2019-Q2AdvancedAnnual report
「By combining the acquired company's laser-related technologies with our semiconductor back-end manufacturing technologies, we aim to enter new markets through the application and development of our core technologies. We also aim to expand revenue opportunities by taking over a sales platform supported by customer trust.」
We carried out a business combination involving the integration of laser-related technologies and semiconductor back-end manufacturing technologies to create new markets through the application and development of our core technologies. - FY2019-Q1RestatedAnnual report
「We also actively expanded Total Solution Service (TSS), which includes modifying products previously delivered by us and selling parts and used equipment.」
We continue to develop TSS as an existing new business, including modifications to delivered products and the sale of parts and used equipment. - FY2018AdvancedAnnual report
「To prepare for future demand for ultra-precision molds and molding equipment, we purchased metal 3D printers to build next-generation processing processes incorporating our expertise. We also invested in initiatives to apply and develop our core technologies and pursue new businesses, including introducing new ultra-precision machining equipment to expand orders and sales in new businesses that use our ultra-precision machining technologies.」
We made specific investments in applying and developing our core technologies and pursuing new businesses, including purchasing metal 3D printers and introducing new ultra-precision machining equipment. - FY2018-Q3RestatedAnnual report
「In the fine-plastic molded products business, we are focusing on initiatives involving new products and expanding our business domain.」
We continue to pursue a policy of expanding the fine-plastic molded products business through initiatives involving new products. - FY2017-Q3RestatedAnnual report
「In new businesses, we will actively expand our glass-cutting business, contract manufacturing using precision machining technologies, the commercialization of TSS, a system providing services to improve equipment utilization and support production after delivery, the high-release coating technology Vancera, and consumables businesses such as CBN end mills and release films.」
We continue to pursue an active expansion of new businesses such as glass cutting, contract manufacturing for precision machining, TSS, Vancera, CBN end mills and release films. - FY2017-Q2RestatedAnnual report
「Meanwhile, we worked to actively pursue business strategies in new fields such as TSS, nanotechnology, tools and coatings, which we are developing based on our core technologies.」
We continue to pursue an active expansion of new businesses such as TSS, nanotechnology, tools and coatings, based on our core technologies. - FY2017-Q1First statedAnnual report
「In new businesses, we will actively develop the glass-cutting business, contract manufacturing using micromachining technology, the high-release coating technology “Vancera,” and consumables businesses such as CBN end mills and release films.」
Specific examples include glass cutting, contract manufacturing for precision machining, Vancera, CBN end mills and release films, along with several other new businesses and consumables businesses.