Research and development and new product releases driven by customer needs
First written in FY2016. 23 of 33 entries say "Restated". Latest entry: FY2026.
23 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「We completed development of water-resistant abrasive paper with an extremely low risk of carcinogenicity, using our proprietary technology, and officially launched the product.」
Development of high-safety water-resistant abrasive paper has progressed through completion and official launch. - FY2026-H1RestatedAnnual report
「Total R&D expenses for the six months ended the interim period were ¥105 million. There were no significant changes in the status of the Group’s R&D activities during the six months ended the interim period.」
The company recorded ¥105 million in R&D expenses and stated that there had been no material changes in its R&D activities. - FY2025AdvancedAnnual report
「We set annual development targets in 3 areas: “development of a line for large-diameter wafers,” “development of technology to reduce wafer processing time” and “establishment of technology to evaluate solution-grown crystals.” We achieved these targets in fiscal 2024.」
The company achieved its 3 annual development targets related to SiC wafers. Annual R&D expenses were ¥158 million, including ¥62 million for contract projects. - FY2025-H1RestatedAnnual report
「Total R&D expenses for the six months ended the interim period were ¥80 million. There were no significant changes in the status of the Group’s R&D activities during the six months ended the interim period.」
Reports ¥80 million in R&D expenses and states that there were no material changes in the status of the Company's R&D activities. - FY2024AdvancedAnnual report
「We also developed polishing equipment for next-generation standard large-diameter (8-inch) SiC (silicon carbide) wafers, which are essential for the development of power semiconductors and high-performance devices and the spread of a decarbonized society and EVs (electric vehicles). By using our polishing film, we established a process capable of stably chamfering SiC, a difficult-to-machine material, through notch and edge polishing.」
Development of polishing equipment for 8-inch SiC wafers and establishment of a stable notch and edge polishing process using polishing film have progressed. R&D expenses were ¥122 million. - FY2024-Q1RestatedAnnual report
「Total research and development expenses for the first quarter of the current fiscal year were ¥47 million. There were no material changes in the status of the Group’s research and development activities during the first quarter.」
There were no significant changes in R&D activities, and R&D expenses for the first quarter were ¥47 million. - FY2023AdvancedAnnual report
「We pursued the development of a polishing-film edge polisher compatible with large-diameter SiC wafers (8 inches), for which demand may increase sharply in the future. For SiC wafer manufacturing applications, we developed a new mechanism capable of handling the wafers in a stable condition. For SiC device applications, we developed a dedicated mechanism specialized for edge trimming, which has been shown to improve yield during the thinning process, and proceeded with test processing and customer inquiries.」
Development of an edge polisher, a new mechanism and a dedicated mechanism for 8-inch SiC wafers has progressed through test processing and customer inquiries. R&D expenses were ¥133 million. - FY2023-Q3RestatedAnnual report
「Total R&D expenses for the nine months ended the third quarter were ¥103 million. There were no significant changes in the status of the Group’s R&D activities during the nine months ended the third quarter.」
The company recorded R&D expenses of ¥103 million and stated that there were no significant changes in the status of its R&D activities. - FY2023-Q1RestatedAnnual report
「Total research and development expenses for the first quarter of the current consolidated cumulative period were ¥52 million. There were no material changes in the status of the Group's research and development activities during the first quarter of the current consolidated cumulative period.」
There were no significant changes in R&D activities, and R&D expenses for the first quarter were ¥52 million. - FY2022AdvancedAnnual report
「To address the challenges facing next-generation semiconductors, we focused on high-value-added compound semiconductors and oxide semiconductors, as well as hybrid wafers composed of multiple materials, and pursued initiatives aimed at creating next-generation hybrid wafers, “Engineered Substrate.” As a result, the Group’s R&D expenses for the fiscal year were ¥48 million.」
The company achieved its annual R&D goals in 3 areas related to next-generation semiconductors and hybrid wafers and pursued activities aimed at creating “Engineered Substrate.” Annual R&D expenses were ¥48 million. - FY2022-Q3RestatedAnnual report
「Total R&D expenses for the nine months ended the third quarter were ¥37 million. There were no significant changes in the status of the Group’s R&D activities during the nine months ended the third quarter.」
There were no significant changes in R&D activities, and R&D expenses were ¥37 million. - FY2022-Q2RestatedAnnual report
「Total R&D expenses for the six months ended the second quarter were ¥29 million. There were no significant changes in the status of the Group’s R&D activities during the six months ended the second quarter.」
The Company recorded ¥29 million in research and development expenses and stated that there were no material changes in the status of its research and development activities. - FY2022-Q1RestatedAnnual report
「Total research and development expenses for the first quarter of the current consolidated cumulative period were ¥18 million. There was no material change in the status of the group’s R&D activities during the first quarter of the current consolidated cumulative period.」
The Company states that there were no material changes in its research and development activities, and that research and development expenses for the first quarter were ¥18 million. - FY2021AdvancedAnnual report
「We released a new high-precision polishing system for device manufacturing processes and established a process capable of stably polishing fragile wafers.」
The Company released a new high-precision polishing system and established a process for stably processing fragile wafers. It has also begun sales of and observation services for XS-1 Sirius. - FY2021-Q3RestatedAnnual report
「Total research and development expenses for the nine months ended the third quarter were ¥47 million. There were no material changes in the status of the Group's research and development activities during the nine months ended the third quarter.」
The Company states that there were no material changes in its research and development activities, and that research and development expenses for the nine months ended the third quarter were ¥47 million. - FY2021-Q2RestatedAnnual report
「Total research and development expenses for the six months ended the second quarter were ¥31 million. There were no material changes in the status of the Group's research and development activities during the six months ended the second quarter.」
The Company continues its research and development activities and reports research and development expenses of ¥31 million for the six months ended the second quarter. There were no material changes in the status of these activities. - FY2021-Q1RestatedAnnual report
「Total research and development expenses for the three months ended the first quarter were ¥25 million. There were no material changes in the status of the Group's research and development activities during the three months ended the first quarter.」
The Company continues its research and development activities, with research and development expenses of ¥25 million. It states that there were no material changes in the status of these activities. - FY2020AdvancedAnnual report
「For observation technology, the crystal-dislocation high-sensitivity visualization system XS-1, we entered into joint research and development agreements with public research institutions and universities and are making steady progress toward a product release in 2021. We have received requests for observation testing from Japan and overseas and have received favorable responses.」
The Company reports a joint research and development agreement for XS-1, requests for testing from Japan and overseas, and plans to release the product in 2021. Research and development expenses were ¥55 million. - FY2020-Q3RestatedAnnual report
「Total research and development expenses for the first nine months of the current consolidated fiscal period were ¥46 million.」
The Company continues its research and development activities and reports research and development expenses of ¥46 million for the nine months ended the third quarter. No material changes in the activities, such as the launch of new products, are mentioned. - FY2020-Q2RestatedAnnual report
「Total research and development expenses for the six-month period of the second quarter of the current consolidated fiscal year were ¥29 million.」
The Company continues its research and development activities and reports research and development expenses of ¥29 million for the six months ended the second quarter. - FY2020-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter were ¥15 million. There was no material change in the status of the Group's R&D activities during the cumulative first quarter.」
The Company continues its research and development activities and reports research and development expenses of ¥15 million for the first quarter. There were no material changes in the status of these activities. - FY2019AdvancedAnnual report
「We advanced development of electroformed diamond abrasive film through joint development by the head office and NK. Through engineering that combined the expertise of both companies, the product is nearly ready for practical use and is scheduled to be launched as a new product in the next fiscal year.」
The electroformed diamond abrasive film is nearly ready for practical use, and the Company explicitly states that it plans to launch it as a new product in the next fiscal year. Research and development expenses were ¥81 million. - FY2019-Q3RestatedAnnual report
「Total research and development expenses for the nine months ended the third quarter were ¥63 million.」
The Company continues its research and development activities and reports research and development expenses of ¥63 million for the nine months ended the third quarter. - FY2019-Q2RestatedAnnual report
「Total research and development expenses for the second quarter of the current consolidated fiscal year were ¥57 million.」
The Company continues its research and development activities and reports research and development expenses of ¥57 million for the six months ended the second quarter. - FY2019-Q1RestatedAnnual report
「Total research and development expenses for the cumulative first quarter of the current consolidated fiscal year were ¥6 million.」
The Company continues its research and development activities and reports research and development expenses of ¥6 million for the quarter. No specific new product names or market-launch results are mentioned. - FY2018AdvancedAnnual report
「For the nonwoven type, we developed and launched a product suitable for polishing increasingly densely patterned circuits. For ceramic grinding-wheel abrasives, we pursued applications expansion based on customer evaluations of their high durability.」
The Company launched polishing wheels for PCBs and has advanced development of high-durability polishing films and flexible polishing paper to the stage at which they can be brought to market. Research and development expenses were ¥33 million. - FY2018-Q3RestatedAnnual report
「Total R&D expenses for the nine-month period ended the third quarter of the current consolidated fiscal year were ¥28 million.」
The Company continues its research and development activities and reports research and development expenses of ¥28 million for the nine months ended the third quarter. - FY2018-Q2RestatedAnnual report
「We pursued various initiatives aimed at developing products and providing services that meet customer needs.」
The Company continues initiatives to develop products and provide services in response to customer needs. - FY2018-Q1RestatedAnnual report
「We pursued various initiatives aimed at developing products and providing services that meet customer needs.」
The Company continues initiatives to develop products and provide services in response to customer needs. No new product names or new release results are mentioned. - FY2017-Q3RestatedAnnual report
「We pursued various initiatives aimed at developing products and providing services that meet customer needs.」
The Company continues initiatives to develop products and provide services in response to customer needs. No new product names or new release results are mentioned. - FY2017-Q2RestatedAnnual report
「We pursued various initiatives aimed at developing products and providing services that meet customer needs.」
The Company continues initiatives to develop products and provide services in response to customer needs. The quarterly report does not mention any new product names or new release results. - FY2017-Q1RestatedAnnual report
「We pursued various initiatives aimed at developing products and providing services that meet customer needs.」
The Company continues initiatives to develop products and provide services in response to customer needs. The quarterly report does not mention any new product names or new release results. - FY2016First statedAnnual report
「In the optical fiber-related business, we developed and newly released the SO26-FB polishing film for finishing processes. These products contributed to recurring sales during the fiscal year.」
The Company developed and commercialized low-contamination polishing films such as Gmaster, SO26-FB and TuneD3FLEX, while also pursuing process improvements and equipment upgrades.