High-performance composite wafer business using ultra-high-vacuum room-temperature bonding equipment
First written in FY2020. 5 of 7 entries say "Advanced", first in FY2021. Latest entry: FY2025.
No other company in this theme has enough history to compare yet.
- FY2025AdvancedAnnual report
「The company is participating in the Ministry of Economy, Trade and Industry's Green Innovation Fund project to build next-generation digital infrastructure and is conducting activities for the development of high-quality, 8-inch, low-cost SiC wafers.」
For 8-inch SiC wafers, the company achieved its three annual targets—line development, processing-hour reductions and evaluation technology for solution-grown crystals—and has progressed to plans to provide processing lines and evaluation equipment and to develop new notch and edge polishing equipment. - FY2024AdvancedAnnual report
「We are consolidating production sites at the Kanuma facility acquired in April 2022. Following the transfer of manufacturing equipment from Thailand, which was an overseas production site in the previous consolidated fiscal year, the current consolidated fiscal year saw the transfer of manufacturing equipment from the Kyoto factory, relocation of the IH powder-coating laboratory, and establishment of a new SiC wafer processing and evaluation equipment line under the NEDO Green Innovation Fund. We are advancing the restructuring of the production system in preparation for future business expansion.」
The company has established a new SiC wafer processing and evaluation equipment line at the Kanuma facility, expanding its production and contract-manufacturing capabilities for advanced wafers, including ambient-temperature bonding and polishing. - FY2023AdvancedAnnual report
「Using the newly installed dedicated cleaning equipment, the company is developing cleaning agents and optimising cleaning conditions, thereby establishing a capacity to meet customer needs across an unprecedented range for both CMP and bonding processes.」
Using the cleanroom and dedicated cleaning equipment at the Kanuma facility, the company is developing cleaning agents and conditions and has established an acceptance system capable of handling CMP and bonding processes. - FY2022AdvancedAnnual report
「The company is also seeking to combine these capabilities with the room-temperature bonding process that follows polishing and processing, thereby establishing a one-stop structure capable of meeting market expectations on a comprehensive basis.」
The company is developing new contract opportunities and polishing technology using ambient-temperature bonding equipment into a one-stop operation combining these capabilities with post-polishing processes. - FY2021AdvancedAnnual report
「The company also developed new contract business using the room-temperature bonding equipment introduced in the previous fiscal year and developed polishing and processing technologies for room-temperature bonding, focusing primarily on high-performance ceramic materials.」
The company is pursuing new contract business using the room-temperature bonding equipment already introduced and developing polishing and processing technologies for high-performance ceramic materials. - FY2021-Q3RestatedAnnual report
「During the first 9 months of the current consolidated fiscal year, there were no material changes to, or newly arising, business or financial challenges that the Group should prioritize addressing.」
The company states that there have been no material changes or new challenges regarding priority matters, including the expansion of its high-performance composite wafer and contract polishing businesses. - FY2020First statedAnnual report
「The main item was the acquisition of ultra-high-vacuum room-temperature bonding equipment for ¥186 million.」
The company introduced the equipment to provide bonding-processing services for various wafers. By combining its existing polishing technology with room-temperature bonding technology, it aims to expand its high-performance composite wafer and contract polishing businesses and establish new businesses, including wafer manufacturing.