High-value-added processing services for next-generation semiconductors through the establishment of CSE
First written in FY2019. 5 of 10 entries say "Advanced", first in FY2020. Latest entry: FY2026.
0 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「We set annual development targets in 3 areas: “development of a line for large-diameter wafers,” “development of technology to reduce wafer processing time,” and “establishment of evaluation technology for solution-grown crystals,” and achieved all of these targets in fiscal 2025. Using these R&D technologies, we plan to provide inspection and evaluation solutions, including an 8-inch SiC processing line, evaluation equipment and consulting services.」
We achieved the 3 annual development targets related to 8-inch SiC wafers in fiscal 2025 and progressed to planning the provision of inspection and evaluation solutions, including processing lines, evaluation equipment and consulting services. - FY2025AdvancedAnnual report
「Using these R&D technologies, we plan to provide an 8-inch SiC processing line and evaluation equipment in the future.」
We achieved our annual development targets related to SiC and progressed to planning the provision of an 8-inch SiC processing line and evaluation equipment. We also began developing new notch and edge polishing equipment and are preparing to provide contract polishing services. - FY2024-Q3Increased orders for advanced materials, but fewer contract projectsAnnual report
「Although orders for processing advanced materials and other products have increased, sales from contract polishing and processing have declined, partly due to the impact of fewer contract projects than anticipated at the beginning of the fiscal year.」
Orders for advanced-material processing have increased, but sales from contract polishing and processing have declined due to the decrease in contract projects anticipated at the beginning of the fiscal year and other factors. - FY2024-Q2Increased inquiries for compound semiconductor substrates and other products, but weak contract volumesAnnual report
「Although inquiries for contract polishing and processing of compound semiconductor substrates and other materials have increased, current contract volumes remain weak, resulting in lower net sales.」
While inquiries for processing compound semiconductor substrates and other materials have increased, current contract volumes and net sales remain weak. - FY2023RestatedAnnual report
「We recognize that, to secure stable earnings and continue growing, an important challenge is to create new products and services using our proprietary technologies in addition to expanding existing products and services. We will address the needs for solving the challenges facing next-generation semiconductors through “Creation” × “Engineering,” combining Mipox’s core technologies with engineering.」
We continue to focus on solving the challenges facing next-generation semiconductors as a priority area for creating new products and services through core technologies and engineering. - FY2022AdvancedAnnual report
「We recognize that, to secure stable earnings and continue growing, an important challenge is to create new products and services using our proprietary technologies in addition to expanding existing products and services. We will address the needs for solving the challenges facing next-generation semiconductors through “Creation” × “Engineering,” combining Mipox’s core technologies with engineering.」
We have defined solutions to the challenges facing next-generation semiconductors as a priority area for creating new products and services by combining core technologies with engineering. - FY2022-Q2RestatedAnnual report
「We will continue our initiatives in next-generation semiconductors based on polishing technologies cultivated over many years in the high-tech field and our expertise as a comprehensive manufacturer of polishing materials.」
We continue to pursue initiatives in next-generation semiconductors based on polishing technologies and expertise in the high-tech field. - FY2021AdvancedAnnual report
「The integrated sales, engineering and manufacturing organization of the CSE Division, established in the fiscal year before last to strengthen this field, has strengthened initiatives to apply our technologies in the next-generation power semiconductor, data center and electronic device fields.」
Through the CSE Division’s integrated sales, engineering and manufacturing organization, we are strengthening initiatives in the next-generation power semiconductor, data center and electronic device fields. - FY2020AdvancedAnnual report
「To strengthen our organizational capabilities, accelerate operations and improve management efficiency, we implemented an organizational reform dividing the organization into the Sales Engineering Section and the Technology Development Section to clarify their respective functional roles. We will further strengthen our initiatives in the next-generation power semiconductor field, a business we began addressing at an early stage and one expected to grow.」
With respect to CSE, which was established in the previous fiscal year, we implemented an organizational reform dividing it into the Sales Engineering Section and the Technology Development Section, and are strengthening initiatives in the next-generation power semiconductor field. - FY2019First statedAnnual report
「To address this issue, we established CSE, an integrated organization bringing together sales, engineering and manufacturing and specializing in technically challenging fields (the abbreviation stands for “Customer Success with Engineering”). We will provide high-value-added processing services using our proprietary technologies for processing materials that are extremely difficult to process and are used in next-generation semiconductors.」
We have established CSE, an integrated sales, engineering and manufacturing organization, and begun measures to provide high-value-added processing services for difficult-to-process materials used in next-generation semiconductors for power and high-frequency devices.