Solder Ball Alternatives and Nano-Scale Plating Technologies
First written in FY2018. 7 of 8 entries say "Advanced", first in FY2019. Latest entry: FY2026.
0 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「The environmentally friendly cyanide-free electroless gold plating solution for high-end FC-BGA substrates is in mass production at customers. During the current fiscal year, we developed an improved-performance next-generation product, and customers began phased mass production. We exhibited at nano tech 2026, the International Nanotechnology Exhibition & Conference, held in January 2026, and began sample work on our products under development.」
For new-device and environmentally friendly technologies, the next-generation product for high-density FC-BGA substrates progressed to phased mass production, while the battery-materials business progressed from exhibiting at an exhibition to beginning sample work. - FY2025AdvancedAnnual report
「During the current fiscal year, we developed an improved-performance next-generation product and reached the customer's final evaluation stage. At the 18th International Secondary Battery Exhibition held in February 2025, we exhibited a poster in the booth of the Osaka Research Institute of Industrial Science and Technology (ORIST), a local incorporated independent administrative agency. We promoted our products under development and began sample work.」
The next-generation product for high-density packages reached the customer's final evaluation stage, while the battery-materials business progressed to exhibiting at a research institute's booth and beginning sample work. - FY2024AdvancedAnnual report
「We exhibited at the 16th International Secondary Battery Exhibition and presented R&D results on electrolytes and metal nanomaterials for next-generation batteries. We advanced preparations for sample work and have already begun sample work in some areas. We also developed stamp-type electrolytic gold plating chemicals as a technology that can help reduce the volume of wastewater.」
The company presented its battery-materials results at an exhibition and began sample work in some areas. It also developed stamp-type electrolytic gold plating chemicals aimed at reducing wastewater and progressed to the sample-work preparation stage. - FY2023AdvancedAnnual report
「We exhibited at the 14th International Secondary Battery Exhibition held in March 2023, where we presented R&D results on electrolytes and metal nanomaterials for next-generation batteries. We received inquiries from Japan and overseas and are preparing for sample work.」
The company disclosed specific progress in technology development for battery materials, including exhibiting at the International Secondary Battery Exhibition, presenting results on electrolytes and metal nanomaterials, receiving inquiries from Japan and overseas, and preparing for sample work. - FY2022AdvancedAnnual report
「We developed an environmentally friendly cyanide-free electroless gold plating solution for advanced, high-density semiconductor package substrates. We also developed an environmentally friendly cyanide-free electrolytic gold plating solution for advanced semiconductor wiring.」
For R&D supporting new devices, the company developed cyanide-free gold plating solutions for high-density semiconductor package substrates and semiconductor wiring. - FY2020AdvancedAnnual report
「We are proposing electroless thick-film tin plating chemicals to the market as functional plating chemicals suited to new packaging technologies, and the product is at the feasibility-study stage. We will continue to view the emergence of new packaging technologies as an opportunity and advance R&D aimed at contributing to earnings several years from now.」
Electroless thick-film tin plating chemicals have progressed to the market-proposal and feasibility-study stages and are positioned as an R&D project aimed at contributing to earnings several years from now. - FY2019AdvancedAnnual report
「We developed plating chemicals capable of stably forming electroless thick-film tin plating, which had been considered technically difficult. This technology replaces solder connections essential to contacts in electronic components. Although it remains at the stage of application development and feasibility studies, we are pursuing R&D on the technology to address the further miniaturization of electronic components expected in the future.」
The solder-ball and solder-connection replacement technology identified as an R&D theme in the previous fiscal year has progressed to the development stage for electroless thick-film tin plating chemicals. However, application development and feasibility studies are still under way. - FY2018First statedAnnual report
「② Support for New Devices ・Plating technology to replace solder balls ・Nano-scale thickness plating technology」
The company identifies solder-ball replacement technology and nano-scale thickness plating technology as R&D themes for supporting new devices, pursued from a Know-Why perspective.