Research and development driven by the two pillars of software technology and materials technology
First written in FY2016. 27 of 37 entries say "Restated". Latest entry: 2026-10-27.
23 other companies' latest entry also says "Restated".
- FY2026AdvancedAnnual report
「① 5G-compatible nickel-free plating technology (DIG, EPIG): Evaluations progressed with multiple customers in Japan and overseas this fiscal year, and the company proceeded with preparations for overall process optimization and commercialization. ② Electroless gold plating technology for high-density packages: The company developed a next-generation product with improved performance, and customers began phased mass production. ④ Battery materials: Sample work began. ⑤ Gold plating technology for microconnectors: Customer evaluations of a new product are underway. Total R&D expenses for the fiscal year ending March 2026 were ¥491.988 million.」
While continuing its R&D policy, the company advanced customer evaluations and preparations for commercialization of DIG and EPIG, phased mass production of the next-generation product for high-density packages, sample work for battery materials, and customer evaluations of a new product for microconnectors. - FY2026-H1RestatedAnnual report
「Total R&D expenses for the interim accounting period were ¥206 million. The company also stated that there had been no material changes in its R&D activities during the interim accounting period.」
The company disclosed R&D expenses of ¥206 million and stated that there had been no material changes in its R&D activities. - FY2025AdvancedAnnual report
「Evaluations progressed with multiple customers this fiscal year, and the company proceeded with preparations for overall process optimization and commercialization. Its environmentally friendly cyanide-free electroless gold plating solution for cutting-edge, high-density semiconductor package substrates is in mass production at customers. This fiscal year, the company developed a next-generation product with improved performance and reached the final customer evaluation stage. Total R&D expenses for the fiscal year ended March 2025 were ¥401.627 million.」
Customer evaluations, process optimization and preparations for commercialization of DIG and EPIG continued, while the next-generation cyanide-free electroless gold plating solution for high-density packages, with improved performance, reached the final customer evaluation stage. R&D expenses were ¥401.627 million. - FY2024AdvancedAnnual report
「Evaluations progressed with multiple customers this fiscal year, and the company proceeded with preparations for overall process optimization and commercialization. Its environmentally friendly cyanide-free electroless gold plating solution for cutting-edge, high-density semiconductor package substrates is in mass production at customers. For battery materials, the company proceeded with preparations for sample work and had already begun sample work with some customers. Total R&D expenses for the fiscal year ended March 2024 were ¥342.537 million.」
DIG and EPIG progressed through customer evaluations, process optimization and preparations for commercialization. The cyanide-free electroless gold plating solution for high-density packages is in mass production at customers, and sample work has begun for some battery materials. R&D expenses were ¥342.537 million. - FY2024-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter were ¥262 million. The company also stated that there had been no material changes in its R&D activities during the cumulative third quarter.」
The company disclosed R&D expenses of ¥262 million and stated that there had been no material changes in its R&D activities. - FY2024-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter were ¥160 million. The company also stated that there had been no material changes in its R&D activities during the cumulative second quarter.」
The company disclosed R&D expenses of ¥160 million and stated that there had been no material changes in its R&D activities. - FY2024-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter were ¥86 million. The company also stated that there had been no material changes in its R&D activities during the cumulative first quarter.」
While stating that there had been no material changes in its R&D activities, the company disclosed R&D expenses of ¥86 million for the cumulative first quarter. - FY2023AdvancedAnnual report
「① Nickel-free plating technology for 5G applications (DIG, EPIG) “Evaluations progressed with multiple customers this fiscal year, and we are proceeding with preparations for overall process optimization and commercialization.” “Total R&D expenses for the fiscal year ended March 2023 were ¥321.581 million.”」
The company disclosed continued R&D based on both software and materials technologies, with concrete progress in evaluations of DIG and EPIG by multiple customers, process optimization and preparations for commercialization. R&D expenses were ¥321.581 million. - FY2023-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter were ¥253 million. The company also stated that there had been no material changes in its R&D activities during the cumulative third quarter.」
While stating that there had been no material changes in its R&D activities, the company disclosed R&D expenses of ¥253 million for the cumulative third quarter. - FY2023-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter were ¥162 million. The company also stated that there had been no material changes in its R&D activities during the cumulative second quarter.」
While stating that there had been no material changes in its R&D activities, the company disclosed R&D expenses of ¥162 million for the cumulative second quarter. - FY2023-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥93 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
The company disclosed R&D expenses of ¥93 million and stated that there had been no material changes in its R&D activities. - FY2022AdvancedAnnual report
「① Nickel-free plating technology for 5G applications (DIG, EPIG) ② Electroless gold plating technology for high-density packages ③ Gold plating technology for semiconductor wiring」
The company disclosed specific R&D achievements based on the two pillars of application technology and materials technology: DIG and EPIG, cyanide-free plating solutions for high-density packages, and cyanide-free electrolytic gold plating solutions for semiconductor wiring. R&D expenses were ¥344.709 million. - FY2022-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥272 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
The company disclosed cumulative third-quarter R&D expenses of ¥272 million but stated that there were no material changes in the status of its R&D activities. - FY2022-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter amounted to ¥172 million. There were no material changes in the status of the company's R&D activities during the cumulative second quarter.」
While stating that there were no material changes in R&D activities, the company disclosed R&D expenses of ¥172 million for the cumulative second quarter. - FY2022-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥101 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
The company disclosed R&D expenses of ¥101 million and stated that there were no material changes in the status of its R&D activities. - FY2021AdvancedAnnual report
「The direct-on-copper plating technologies DIG and EPIG, on which we have conducted R&D to date, made significant progress toward commercialization in response to growing customer demand. Total R&D expenses for the 50th fiscal year (fiscal year ended March 2021) amounted to ¥317.891 million.」
The company disclosed that its direct-on-copper plating technologies, DIG and EPIG, made significant progress toward commercialization in response to growing customer demand. R&D expenses were ¥317.891 million. - FY2021-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥248 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
While stating that there were no material changes in R&D activities, the company disclosed R&D expenses of ¥248 million for the cumulative third quarter. - FY2021-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter amounted to ¥154 million. There were no material changes in the status of the company's R&D activities during the cumulative second quarter.」
The company disclosed R&D expenses of ¥154 million and stated that there were no material changes in the status of its R&D activities. - FY2021-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥85 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
The company disclosed R&D expenses of ¥85 million and stated that there were no material changes in the status of its R&D activities. - FY2020AdvancedAnnual report
「For precious-metal plating chemicals for microconnectors, the launch of improved products made a significant contribution to expanding our market share. We are also proposing an electroless thick tin plating chemical to the market as a functional plating chemical compatible with new packaging technologies, and it is at the commercialization-review stage. Total R&D expenses for the 49th fiscal year (fiscal year ended March 2020) amounted to ¥334.979 million.」
The company disclosed the contribution of the improved product launch to market-share growth, as well as the market proposal and commercialization-review stage for its electroless thick tin plating chemical. R&D expenses amounted to ¥334.979 million. - FY2020-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥261 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
While stating that there were no material changes in R&D activities, the company disclosed R&D expenses of ¥261 million for the cumulative third quarter. - FY2020-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter amounted to ¥163 million. There were no material changes in the status of the company's R&D activities during the cumulative second quarter.」
The company disclosed R&D expenses of ¥163 million and stated that there were no material changes in the status of its R&D activities. - FY2020-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥89 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
The company disclosed R&D expenses of ¥89 million and stated that there were no material changes in the status of its R&D activities. - FY2019AdvancedAnnual report
「We developed a plating chemical capable of stably forming electroless thick tin plating, which had been considered technically difficult. This technology is an alternative to solder connections essential for contacts in electronic components. Although it remains at the application-development and commercialization-review stage, we are conducting R&D on it as a technology capable of addressing the further miniaturization of electronic components expected in the future. Total R&D expenses for the 48th fiscal year (fiscal year ended March 2019) amounted to ¥280.814 million.」
A specific R&D achievement was obtained through the development of an electroless thick tin plating chemical. However, it remains at the application-development and commercialization-review stage. R&D expenses amounted to ¥280.814 million. - FY2019-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥219 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
The company disclosed R&D expenses of ¥219 million and stated that there were no material changes in the status of its R&D activities. - FY2019-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter amounted to ¥134 million. There were no material changes in the status of the company's R&D activities during the cumulative second quarter.」
The company disclosed R&D expenses of ¥134 million and stated that there were no material changes in the status of its R&D activities. - FY2019-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥73 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
R&D expenses were ¥73 million, and no material changes were reported in the status of R&D activities. - FY2018RestatedAnnual report
「Our basic R&D policy is to address globalization by making full use of application technology while cultivating next-generation materials technology from a long-term perspective. Total R&D expenses for the 47th fiscal year (fiscal year ended March 2018) amounted to ¥199.626 million.」
The company continues to pursue an R&D policy based on the two pillars of application technology and materials technology. R&D expenses were ¥199.626 million, down from ¥220.134 million in the previous fiscal year. - FY2018-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥155 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
The company disclosed R&D expenses of ¥155 million but stated that there were no material changes in the status of its R&D activities. - FY2018-Q2RestatedAnnual report
「Total R&D expenses for the cumulative second quarter amounted to ¥92 million. There were no material changes in the status of the company's R&D activities during the cumulative second quarter.」
The company disclosed R&D expenses of ¥92 million and stated that there were no material changes in the status of its R&D activities. - FY2018-Q1RestatedAnnual report
「Total R&D expenses for the cumulative first quarter amounted to ¥50 million. There were no material changes in the status of the company's R&D activities during the cumulative first quarter.」
The company disclosed R&D expenses of ¥50 million and stated that there were no material changes in the status of its R&D activities. - FY2017AdvancedAnnual report
「The direct EPIG plating process for ENEPIG is expected to expand high-frequency applicability for RF modules and other applications. In the 46th fiscal year, EPIG was tested on an actual production line, producing good results and bringing it one step closer to commercialization. A pure-gold plating solution that increases bump hardness while maintaining a gold purity of at least 99.9% has been developed and is currently being evaluated by customers. Total R&D expenses for the 46th fiscal year (fiscal year ended March 2017) amounted to ¥220.134 million.」
In addition to maintaining its R&D policy, the company achieved good results in testing EPIG on an actual production line, advancing it toward commercialization, while its pure-gold plating solution reached the customer evaluation stage. R&D expenses were ¥220.134 million. - FY2017-Q3RestatedAnnual report
「Total R&D expenses for the cumulative third quarter amounted to ¥174 million. There were no material changes in the status of the company's R&D activities during the cumulative third quarter.」
The company disclosed R&D expenses of ¥174 million and stated that there were no material changes in the status of its R&D activities. - FY2017-Q2RestatedAnnual report
「There were no material changes in the status of our research and development activities during the cumulative second quarter period.」
No material changes have been reported in the status of R&D activities, and the R&D policy based on the two pillars of application technology and materials technology has been maintained. - FY2016First statedAnnual report
「Our basic R&D policy is to address globalization by making full use of application technology while cultivating next-generation materials technology from a long-term perspective.」
The company is pursuing separately the application technology used to adapt existing chemicals to customers' equipment and the materials technology used to develop new chemicals.