ONE-WAYOngoing theme · still written in the latest filings
Development of plating technologies and chemical solutions for next-generation semiconductor packaging
An initiative focused on developing and commercialising multiple plating processes and plating solutions for semiconductor packaging, covering tin-based bumps, copper pillars and next-generation package substrates, and expanding their market adoption.
Companies1How many companies write about this.
Threads1One company can carry more than one thread here.
PeriodFY2016 →Still being written about.
Directionhelps1 helps · 0 hurts · 0 flat