Issuance of Private Placement Bonds to Secure Capital Investment and Working Capital
First written in FY2017-Q2. 3 of 5 entries say "Advanced", first in FY2017. Latest entry: FY2020-Q2.
62 other companies' latest entry also says "Advanced".
- FY2020-Q2AdvancedAnnual report
「Net cash provided by financing activities was ¥3,436 million, compared with ¥2,537 million in the same period of the previous fiscal year. This was mainly due to ¥4,921 million in proceeds from the issuance of bonds.」
Regarding the securing of funds for capital investment and working capital, ¥4,921 million in proceeds from the issuance of bonds was recognized during the first six months of the current fiscal year. - FY2019-Q2AdvancedAnnual report
「Net cash provided by financing activities was ¥2,537 million, compared with net cash used of ¥511 million in the same period of the previous fiscal year. This was mainly due to ¥2,967 million in proceeds from the issuance of bonds.」
Regarding the securing of funds for capital investment and working capital, ¥2,967 million in proceeds from the issuance of bonds was recognized during the first six months of the current fiscal year. - FY2017AdvancedAnnual report
「Net cash provided by financing activities increased by ¥676 million, an increase of ¥1,696 million year on year. This was mainly due to ¥2,939 million in proceeds from the issuance of bonds.」
For the private placement bonds planned to secure capital investment and working capital, ¥2,939 million in proceeds from the issuance of bonds was recognized, moving disclosure from the planning stage to the actual issuance. - FY2017-Q3SoftenedAnnual report
「At a meeting of the Board of Directors held on 10 February 2017, the Company resolved to issue private placement bonds to secure funds required for future business development. The total issue amount of the bonds is capped at ¥1 billion, issuance is scheduled from February 2017 onward, and the proceeds will be used for capital investment and working capital.」
For the private placement bond issuance plan, the issuance period changed to February 2017 onward, and the total issue amount changed from up to ¥2 billion to up to ¥1 billion. - FY2017-Q2First statedAnnual report
「At a meeting of the Board of Directors held on 11 November 2016, the Company resolved to issue private placement bonds to secure funds required for future business development. The total issue amount of the bonds is capped at ¥2 billion, issuance is scheduled from November 2016 onward, and the proceeds will be used for capital investment and working capital.」
It disclosed for the first time a plan to issue private placement bonds with a total issue amount of up to ¥2 billion from November 2016 onward, using the proceeds for capital investment and working capital required for future business development.