Samsung Electronics has opened a semiconductor packaging research center in Yokohama. The company said it plans to strengthen collaboration with Japanese companies in the equipment and materials sectors.
Samsung Electronics has opened a new semiconductor packaging research center in Yokohama, with approximately 100 people, including Vice Chairman Jeon Young-hyun (全永鉉) and Japanese and South Korean government officials, in attendance.
The center will connect Samsung's semiconductor manufacturing technology with Japan's strengths in equipment and materials technologies, with an investment of ¥40 billion expected over the five years from 2024.
In connection with the development of semiconductors for AI, Samsung aims to strengthen advanced packaging technologies that combine multiple integrated circuits, and plans to accelerate technology development through collaboration with Japanese manufacturers, universities and research institutions.
The company is expected to continue efforts to connect Japan's areas of strength with Samsung's technology through cooperation with companies and research institutions in both countries.