浅原技研 will present a palm-sized 3D sensing demonstration using QD Laser’s LSP module at CEATEC 2026. The system projects a striped pattern to generate a 3D point cloud and can switch among three methods in a single unit: phase shifting, moiré and optical sectioning.
浅原技研 announced that it will demonstrate a 3D sensing system using a laser scanning projector (LSP) module as its light source at QD Laser’s booth at CEATEC 2026. The demonstration will take place at booth 8H122 in Hall 8.
The demonstration combines QD Laser’s LSP module with 浅原技研’s camera, synchronization mechanism and measurement software, capturing the projected striped pattern with a camera and converting it into a 3D point cloud. The LSP module scans using a semiconductor laser and a two-axis MEMS mirror, and is focus-free, with images less likely to distort during angled projection. The module weighs approximately 35 g and connects via USB Type-C.
3D measurement supports three methods: phase shifting, moiré and optical sectioning. The methods can be selected by switching the projected image. The demonstration unit has a field of view of 46.0 × 44.0 mm, XY resolution of 0.046 mm/pixel, a Z range of 2.5 mm and Z accuracy of 0.02 mm. In the future, the system is intended for visual inspection and dimensional measurement, as well as mounting on robots and integration into automated equipment.