Asahara Giken of Gifu will unveil at CEATEC 2026 a working palm-sized 3D sensor using QD Laser’s LSP module. It will showcase a demonstration unit incorporating Ultimems’ MEMS technology.
At QD Laser’s booth (8H122) at CEATEC 2026, Asahara Giken will demonstrate a newly developed 3D sensing unit. The prototype uses QD Laser’s LSP module as its light source, combined with Asahara Giken’s camera, synchronisation and measurement software, demonstrating Japanese and Taiwanese technologies in a single working unit. The overall concept has also been published on a dedicated 3D page ahead of the event.
The core of the exhibition is the conversion into a 3D point cloud of fringes projected by the LSP module. The image remains intact even with oblique projection and is focus-free, while the unit has been miniaturised to approximately 35g. A single unit can switch among three measurement methods, phase-shifting, moiré and light-sectioning, and uses USB-C for power and image transfer.
The exhibition unit has a 46.0×44.0mm field of view, XY resolution of 0.046mm/pixel, a Z range of 2.5mm and Z accuracy of 0.02mm. Asahara Giken’s measurement software converts the captured fringes into a 3D point cloud.
Asahara Giken develops its own 2D + 3D + AI inspection solutions, and the demonstration unit is positioned as a new option for miniaturising the 3D component.
At CEATEC 2026, Asahara Giken is also prepared to discuss applications including visual inspection and robot integration.