Against the backdrop of expanding data center investment, Lister has launched a report analyzing demand spillover. Using large-scale domestic investment plans as a starting point, it organizes the spillover effects and market entry opportunities extending from power, liquid cooling and optical communications to materials, processing and maintenance.
Lister has launched the "2026 Report on Demand Spillover from Large-Scale Domestic Data Center Investment," which analyzes the demand structure and market entry opportunities associated with large-scale data center investment in Japan. The report comprises 10 chapters and appendices and is positioned as a resource that can be used together with the accompanying database.
The report organizes the spillover from data center development, tracing links from elements such as power supply, liquid cooling and optical communications to related industries including materials, processing, construction and maintenance. It includes analysis to support the exploration of new applications for proprietary technologies, comparison of collaboration opportunities and preparation for initial meetings.
The four main analytical themes are as follows. First, power, liquid cooling and optical communications are broken down into work involving materials and processing. Next, the report organizes how technological changes affect the volume and nature of demand and the companies selected. The third theme considers the timing of proposals based on development processes and ongoing demand after operations begin. The fourth organizes areas open to entry by companies from other industries and the conditions for adoption. Finally, it explains how to compare potential companies using the Data Center ¥10 Trillion Investment Demand Spillover Companies Database.
The report includes an appendix covering basic knowledge of the data center industry and examples of how to use the corporate database. The full version is available for purchase, and samples of the PDF report and Excel data are provided through the application page.