Samsung Electronics Chairman Lee Jae-yong (李在鎔) of South Korea visited APL, an advanced semiconductor packaging hub in Yokohama, inspected its research activities and discussed strengthening cooperation with Japanese companies. Established in 2023 and opened in September 2026, APL aims to become an AI semiconductor research hub.
Samsung Electronics Chairman Lee Jae-yong (李在鎔) of South Korea visited the Advanced Package Lab (APL), an advanced semiconductor packaging research hub in Yokohama, and received a briefing on its current research activities. It was his first visit, 2 months after the facility’s official opening.
He discussed ways to cooperate with Japanese companies and indicated an intention to secure advanced packaging technologies that will influence semiconductor competitiveness in the AI era. APL is responsible for developing and validating elemental packaging technologies and is tasked with coordinating with Japan’s technological base in materials, components and manufacturing equipment.
APL was established in 2023 and held its opening ceremony in September 2026. Going forward, it will develop next-generation manufacturing processes and materials technologies, including wafer bonding and glass substrates, while also studying high-performance package structures with the aim of establishing mass-production capabilities for low-power, high-performance AI semiconductors. It is also expanding its local workforce.
Before this visit, Chairman Lee had inspected semiconductor hubs in South Korea and overseas, continuing a broader effort covering NRD-K’s development plans and HBM-related production and research. Samsung plans to continue developing its research base in Japan and strengthen cooperation with the Japanese government’s semiconductor and AI strategies.