Samsung Electronics Chairman Lee Jae-yong visited APL in Yokohama to inspect progress in advanced packaging technology development. He discussed cooperation proposals with Japanese companies, in a move again reported as strengthening technological collaboration through the local facility.
Samsung Electronics Chairman Lee Jae-yong (李在鎔) visited the Advanced Packaging Lab (APL) in Yokohama to inspect progress in the development of next-generation packaging technology. APL was opened in 2024, and Samsung positions the facility as a base for deepening cooperation with Japanese companies in materials, components and equipment.
On the same day, Chairman Lee Jae-yong (李在鎔) inspected technology development progress in areas including wafer bonding and glass substrates with the research team and discussed cooperation proposals with Japanese companies. APL plans to invest ¥40 billion over the next 5 years, strengthen its research workforce and develop into a global R&D hub.
The main Japanese companies cited include Tokyo Electron, JSR, Tokyo Ohka Kogyo and Ibiden. The companies shared a policy of strengthening cooperation in semiconductor materials, equipment and packaging. Samsung places importance on cooperation markets with Japanese companies and is expected to increase local R&D investment and expand its intercompany network.
In the past, Chairman Lee Jae-yong (李在鎔) reportedly chaired regular LJF meetings in Japan and continued the shuttle-management approach. This visit is also positioned as part of an effort to expand cooperation with Japan to secure future semiconductor technologies.