As demand for AI servers expands rapidly, Furukawa Electric is increasing production of ultra-thin copper foil. The company's developments are attracting attention on the front line of competition for global semiconductor supply.
Demand for AI server applications is expanding rapidly, and demand for high-performance materials for data centers is also increasing. As a result, the copper-foil supply structure is also beginning to change.
The article reports that Furukawa Electric plans to increase production of ultra-thin copper foil. The production increase is intended to meet expanding demand for applications including AI servers and high-frequency circuit boards.
The move is linked to intensifying competition in the global semiconductor industry, and the actions of companies strengthening their supply capacity are attracting market attention.