Samsung is establishing a research base in Japan and advancing the development of next-generation AI chips in collaboration with local companies, centred on the Advanced Package Lab in Yokohama’s Minato Mirai district. The investment will amount to several billion yen and will be carried out in phases from 2024 through 2029.
Samsung has set a policy of making Japan a centre for advanced AI chip research and announced plans to establish the Advanced Package Lab (APL) in Yokohama’s Minato Mirai district to strengthen its domestic research and development capabilities. The facility is expected to test next-generation packaging technologies and develop prototypes. Japanese and South Korean scientists will work together there, and additional specialists may be added in the future.
APL plans to make extensive use of local resources and is already expected to collaborate with approximately 50 local companies. Samsung is reportedly aiming to strengthen the competitiveness of its products by demonstrating Japan’s advanced semiconductor technologies locally.