According to SEMI's latest forecast, equipment investment in the world's 300mm front-end fabs is expected to increase from $149 billion in 2026 to $227 billion in 2029. Capacity expansion is advancing against a backdrop of growing demand for AI and HPC.
SEMI announced in its latest 300mm Fab Outlook that equipment investment in the world's 300mm front-end semiconductor fabs will rise 31% year on year to $149 billion in 2026 and reach $227 billion in 2029. Increased front-end capital expenditure is expected to support expanded production capacity for leading-edge logic and memory.
Investment in the Americas is also expected to increase, from $18.1 billion in 2026 to $40.6 billion in 2029. Fab construction and equipment installation are expected to continue in each region against a backdrop of rising demand for AI and HPC.
Construction investment is also expected to grow significantly. Global 300mm fab construction investment is expected to increase to $47.5 billion in 2026 and $63.3 billion in 2027, reaching $68.4 billion in 2028. This is expected to spur subsequent investment in cleanrooms and equipment installation.
Construction starts and transitions to operations are also advancing in the Americas, where 3 new 300mm fabs or production lines are expected to begin construction in 2026 and 4 in 2027. SEMI has published a report reflecting 166 changes across 163 fabs and lines worldwide.