SK hynix subsidiary Solidigm will resume investment in its second Dalian fab, with manufacturing equipment potentially being brought in as early as November. Total production capacity at the Dalian site is expected to reach 150,000 wafers per month after Phase 2 begins operations, while the company is also considering building a large-scale fab in Miyagi Prefecture.
Solidigm, a subsidiary of South Korea’s SK hynix, is reportedly planning to resume investment in its second Dalian NAND fab and begin bringing in equipment as early as this year. The new fab is expected to have wafer input capacity of 40,000–60,000 wafers per month, with mass production targeted to begin in the first half of 2027. The current monthly output of Dalian Fab 1 is approximately 100,000 wafers, and total production capacity is expected to reach 150,000 wafers per month after Phase 2 begins operations, approaching half of the company’s NAND production capacity.
In addition to China, further investment in Japan is being considered, with reports suggesting plans for a large-scale memory fab in Miyagi Prefecture. The potential investment could reach tens of trillions of won, which is said to be a condition based on the use of Japan’s government subsidy program. Japan’s advantages in materials and equipment have been cited, along with the view that building a local fab would strengthen the supply chain.
As confrontation and cooperation with the US continue both domestically and internationally, attention is also focused on developments in US export licenses for equipment. The US has continued urging the South Korean government and companies to invest in semiconductors in the United States, while also expressing dissatisfaction with the Honam semiconductor cluster plan. South Korean companies are consequently being pressed to balance US demands with their investment plans at home and abroad, and the supply chain is expected to remain a multilayered structure spanning China, Japan and the United States.