TMH and ティアンドエスグループ have entered into a memorandum of understanding for a business alliance in the semiconductor industry solutions sector. Going forward, they will integrate hardware maintenance and software development to establish a comprehensive support structure for resolving on-site challenges.
TMH and ティアンドエスグループ have entered into a memorandum of understanding for a business alliance aimed at providing solutions for semiconductor and equipment manufacturers. TMH brings experience in maintenance and servicing as well as sales channels, while T&SG brings software development capabilities and on-site expertise, with the two companies seeking to complement each other. Through this alliance, they aim to provide end-to-end solutions that address on-site challenges in an integrated manner across both hardware and software.
As the first service offering, priority will be given to software engineer staffing to respond quickly to on-site needs; maintenance, operation and servicing of existing systems; the development and operation of peripheral systems; and data integration, visualisation and reporting. The offering will also include the provision of additional engineering resources through on-site assignments and quasi-mandate engagements.
Over the medium to long term, the companies plan to expand the scope of the alliance to cover system development services as a whole, including commissioned development of new systems, construction of core systems and large-scale modifications. They are also considering strengthening their ability to respond locally through coordination and shared use of bases in regions with concentrated Fab facilities, including Kyushu and Tohoku.