Funding Through Bond Issuance
First written in FY2017-Q2. 32 of 38 entries say "Advanced", first in FY2017-Q3. Latest entry: 2026-09-03.
62 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「55th Unsecured Bond (with a pari passu clause limited to bonds): 12 March 2026; ¥90,292 million; interest rate: 2.52%; maturity date: 12 March 2030.」
On 12 March 2026, the company issued approximately ¥90.3 billion of the 55th Unsecured Bond. It is adding to its direct financing through bonds during the fiscal year. - FY2026-H1AdvancedAnnual report
「During the interim consolidated accounting period, the company issued ¥73,460 million in bonds. This comprised US dollar-denominated bonds of ¥73,460 million (annual interest rate: 6.130%; issue date: 18 September 2025; maturity date: 18 September 2035).」
In September 2025, the company issued US dollar-denominated bonds totaling ¥73,460 million, carrying out additional direct financing through bonds. - FY2025AdvancedAnnual report
「51st Unsecured Bond (with a pari passu clause limited to bonds): 12 March 2025; ¥39,653 million; interest rate: 2.60%; maturity date: 12 March 2032.」
On 12 March 2025, the company issued approximately ¥39.7 billion of the 51st Unsecured Bond, adding to its direct financing through bonds during the fiscal year. - FY2025-H1AdvancedAnnual report
「During the interim consolidated accounting period, the company issued ¥95,000 million in bonds. This comprised the 48th Unsecured Bond of ¥75,000 million (annual interest rate: 2.05%; issue date: 26 April 2024; maturity date: 25 April 2031), the 49th Unsecured Bond of ¥10,000 million (annual interest rate: 1.073%; issue date: 11 September 2024; maturity date: 10 September 2027) and the 50th Unsecured Bond of ¥10,000 million (annual interest rate: 1.580%; issue date: 11 September 2024; maturity date: 11 September 2029).」
The company issued a total of ¥95 billion in unsecured bonds in April and September 2024, carrying out additional direct financing. - FY2024AdvancedAnnual report
「45th Unsecured Bond (with a pari passu clause limited to bonds) (social bond): 14 March 2024; ¥19,931 million; interest rate: 0.58%; maturity date: 12 March 2027.」
On 14 March 2024, the company issued a total of approximately ¥34.9 billion in unsecured bonds, from the 45th through the 47th issues, including a social bond. It continues to raise funds directly through bond issuance. - FY2024-Q3AdvancedAnnual report
「At a Board of Directors meeting held on 13 February 2024, the company resolved to issue unsecured straight bonds with a maximum issue amount of ¥50 billion. The principal uses of proceeds are planned to be the redemption of bonds and repayment of borrowings.」
The company resolved to set a maximum issue amount of ¥50 billion for unsecured straight bonds and specified that the proceeds are planned to be used for bond redemptions and repayment of borrowings. - FY2024-Q2AdvancedAnnual report
「During the cumulative second quarter, the company issued ¥56,900 million in bonds. This comprised the 42nd Unsecured Bond of ¥40,000 million (annual interest rate: 1.11%; issue date: 9 June 2023; maturity date: 9 June 2028), the 43rd Unsecured Bond of ¥6,900 million (interest rate: six-month Japanese yen TIBOR + 1.26%; issue date: 1 June 2023; maturity date: 31 May 2030) and the 44th Unsecured Bond of ¥10,000 million (annual interest rate: 2.38%; issue date: 29 August 2023; maturity date: 29 August 2033).」
The company issued a total of ¥56.9 billion in unsecured bonds, from the 42nd through the 44th issues, carrying out additional direct financing. - FY2024-Q1AdvancedAnnual report
「During the cumulative first quarter, the company issued ¥46,900 million in bonds. This comprised the 42nd Unsecured Bond of ¥40,000 million (annual interest rate: 1.11%; issue date: 9 June 2023; maturity date: 9 June 2028) and the 43rd Unsecured Bond of ¥6,900 million (interest rate: six-month Japanese yen TIBOR + 1.26%; issue date: 1 June 2023; maturity date: 31 May 2030).」
The company issued a total of ¥46.9 billion in unsecured bonds in June 2023, carrying out additional direct financing. In addition, after the filing, it resolved to issue up to ¥20 billion in unsecured straight bonds. - FY2023AdvancedAnnual report
「41st Unsecured Bond (with a pari passu clause limited to bonds): 1 March 2023; ¥29,906 million; interest rate: 0.47%; maturity date: 27 February 2026.」
On 1 March 2023, the company issued approximately ¥30 billion of the 41st Unsecured Bond. Bond issuance and other activities resulted in positive cash flow from financing activities of ¥69,217 million for the full year. - FY2023-Q3RestatedAnnual report
「During the cumulative third quarter, the company issued ¥57,000 million in bonds. This comprised the 38th Unsecured Bond of ¥15,000 million (annual interest rate: 0.68%; issue date: 9 May 2022; maturity date: 7 May 2027), the 39th Unsecured Bond of ¥10,000 million (annual interest rate: 1.17%; issue date: 9 May 2022; maturity date: 7 May 2032), the 40th Unsecured Bond of ¥22,000 million (annual interest rate: 1.00%; issue date: 9 August 2022; maturity date: 9 August 2029) and the 11th Unsecured Bond of ¥10,000 million (annual interest rate: 0.58%; issue date: 29 September 2022; maturity date: 29 September 2025).」
The notes to bonds for the third quarter reconfirm the issuance of a total of ¥57 billion in unsecured bonds in May, August and September 2022. - FY2023-Q2AdvancedAnnual report
「During the cumulative second quarter, the company issued ¥57,000 million in bonds. This comprised the 38th Unsecured Bond of ¥15,000 million, the 39th Unsecured Bond of ¥10,000 million, the 40th Unsecured Bond of ¥22,000 million and the 11th Unsecured Bond of ¥10,000 million.」
The company issued a total of ¥57 billion in unsecured bonds in May, August and September 2022, carrying out additional direct financing. - FY2023-Q1AdvancedAnnual report
「Based on a resolution of the Board of Directors meeting held on 24 June 2022, the company issued the following bonds on 9 August 2022. 40th Unsecured Bond; (2) Total issue amount: ¥22 billion; (8) Maturity date: 9 August 2029 (7-year bond); (10) Use of proceeds: redemption of bonds.」
On 9 August 2022, after the filing, the company issued ¥22 billion of the 40th Unsecured Bond and raised funds to redeem bonds. - FY2022AdvancedAnnual report
「40th Unsecured Bond: Total issue amount ¥15 billion; use of proceeds: redemption of bonds. 39th Unsecured Bond: Total issue amount ¥10 billion; use of proceeds: redemption of bonds.」
On 9 May 2022, after the filing, the company issued ¥25 billion in unsecured bonds and raised funds to redeem bonds. - FY2022-Q3RestatedAnnual report
「During the nine-month consolidated cumulative period under review, we issued ¥115,000 million in bonds. This comprised the 32nd unsecured corporate bond of ¥10,000 million (annual interest rate: 0.30%; issue date: 16 June 2021; maturity date: 16 June 2026), the 33rd unsecured corporate bond of ¥15,000 million (annual interest rate: 0.85%; issue date: 16 June 2021; maturity date: 16 June 2031), the 34th unsecured corporate bond of ¥25,000 million (annual interest rate: 1.85%; issue date: 16 June 2021; maturity date: 14 June 2041), the 35th unsecured corporate bond of ¥10,000 million (annual interest rate: 0.20%; issue date: 4 November 2021; maturity date: 4 November 2026), the 36th unsecured corporate bond of ¥30,000 million (annual interest rate: 0.80%; issue date: 4 November 2021; maturity date: 4 November 2031) and the 37th unsecured corporate bond of ¥25,000 million (annual interest rate: 1.33%; issue date: 4 November 2021; maturity date: 4 November 2036).」
The amount of bonds issued during the cumulative third quarter was disclosed as ¥115 billion, reconfirming the issuance results for June and November together. - FY2022-Q2AdvancedAnnual report
「During the six-month consolidated cumulative period under review, we issued ¥50,000 million in bonds. This comprised the 32nd unsecured corporate bond of ¥10,000 million (annual interest rate: 0.30%; issue date: 16 June 2021; maturity date: 16 June 2026), the 33rd unsecured corporate bond of ¥15,000 million (annual interest rate: 0.85%; issue date: 16 June 2021; maturity date: 16 June 2031) and the 34th unsecured corporate bond of ¥25,000 million (annual interest rate: 1.85%; issue date: 16 June 2021; maturity date: 14 June 2041).」
The company issued a total of ¥50 billion in unsecured corporate bonds during the quarter. In addition, on 4 November 2021, after the filing, it issued a total of ¥60 billion in bonds numbered 35th through 37th, adding to its direct financing. - FY2022-Q1AdvancedAnnual report
「During the three-month consolidated cumulative period under review, we issued ¥50,000 million in bonds. This comprised the 32nd unsecured corporate bond of ¥10,000 million (annual interest rate: 0.30%; issue date: 16 June 2021; maturity date: 16 June 2026), the 33rd unsecured corporate bond of ¥15,000 million (annual interest rate: 0.85%; issue date: 16 June 2021; maturity date: 16 June 2031) and the 34th unsecured corporate bond of ¥25,000 million (annual interest rate: 1.85%; issue date: 16 June 2021; maturity date: 14 June 2041).」
On 16 June 2021, the company issued a total of ¥50 billion in unsecured corporate bonds and conducted additional direct financing. - FY2021AdvancedAnnual report
「Net cash provided by financing activities was ¥89,807 million, mainly due to the issuance of bonds and other factors.」
The company issued a total of ¥30 billion in unsecured corporate bonds on 14 July 2020 and ¥50 billion on 2 February 2021, resulting in net cash provided by financing activities of ¥89,807 million for the year. After the filing, it also issued a total of ¥50 billion in bonds numbered 32nd through 34th. - FY2021-Q3AdvancedAnnual report
「29th unsecured corporate bond (2) Total issue amount: ¥10 billion 30th unsecured corporate bond (2) Total issue amount: ¥15 billion 31st unsecured corporate bond (2) Total issue amount: ¥25 billion」
On 2 February 2021, the company issued a total of ¥50 billion in the 29th through 31st unsecured corporate bonds and conducted additional direct financing to fund the repayment of borrowings and bonds. - FY2021-Q2RestatedAnnual report
「During the six-month consolidated cumulative period under review, we issued ¥30,000 million in bonds. This comprised the 27th unsecured corporate bond of ¥10,000 million (annual interest rate: 0.45%; issue date: 14 July 2020; maturity date: 14 July 2025) and the 28th unsecured corporate bond of ¥20,000 million (annual interest rate: 1.20%; issue date: 14 July 2020; maturity date: 12 July 2030).」
The quarterly bond note reconfirms the company's issuance of a total of ¥30 billion in unsecured corporate bonds on 14 July 2020. - FY2021-Q1AdvancedAnnual report
「Based on a resolution adopted at a meeting of our Board of Directors held on 26 June 2020, we issued the following bonds on 14 July 2020. 27th unsecured corporate bond: total issue amount, ¥10 billion; use of proceeds, funds for repayment of borrowings and redemption of bonds. 28th unsecured corporate bond: total issue amount, ¥20 billion; use of proceeds, funds for repayment of borrowings and redemption of bonds.」
On 14 July 2020, after the filing, the company issued a total of ¥30 billion in the 27th and 28th unsecured corporate bonds and conducted additional direct financing to fund the repayment of borrowings and bonds. - FY2020RestatedAnnual report
「Net cash provided by financing activities was ¥61,075 million, mainly due to the issuance of bonds.」
The company continued direct financing, including through bond issuance, and net cash provided by financing activities was ¥61,075 million. - FY2020-Q3RestatedAnnual report
「During the nine-month consolidated cumulative period under review, we issued ¥76,500 million in bonds.」
The company disclosed bond issuance of ¥76,500 million for the nine-month cumulative period under review. Because the additional issues had already been reported as issuances after the previous quarterly report, the disclosure reconfirms the status of direct financing. - FY2020-Q2AdvancedAnnual report
「During the six-month consolidated cumulative period under review, we issued ¥50,000 million in bonds. This comprised the 21st unsecured corporate bond of ¥5,000 million (annual interest rate: 0.24%; issue date: 8 August 2019; maturity date: 8 August 2024), the 22nd unsecured corporate bond of ¥5,000 million (annual interest rate: 0.32%; issue date: 8 August 2019; maturity date: 7 August 2026) and the 23rd unsecured corporate bond of ¥40,000 million (annual interest rate: 1.38%; issue date: 8 August 2019; maturity date: 8 August 2034).」
On 8 August 2019, the company issued a total of ¥50 billion in unsecured corporate bonds and conducted additional direct financing. In addition, after the filing, it issued a total of ¥26.5 billion in bonds, numbered 24th through 26th, on 8 November. - FY2020-Q1AdvancedAnnual report
「Based on a resolution adopted at a meeting of our Board of Directors held on 22 July 2019, we issued the following bonds on 8 August 2019. 21st unsecured corporate bond (2) Total issue amount: ¥5 billion 22nd unsecured corporate bond (2) Total issue amount: ¥5 billion 23rd unsecured corporate bond (2) Total issue amount: ¥40 billion」
On 8 August 2019, the company issued a total of ¥50 billion in unsecured corporate bonds and conducted additional direct financing to fund the repayment of borrowings and the redemption of bonds. - FY2019AdvancedAnnual report
「29 March 2019 Short-term bonds 10,000 (10,000) 0.00 26 April 2019」
On 29 March 2019, the company issued ¥10 billion in short-term bonds and conducted additional direct financing, including through bonds. - FY2019-Q3AdvancedAnnual report
「During the nine-month consolidated cumulative period under review, we issued ¥35,000 million in bonds. This comprised the 19th unsecured corporate bond of ¥10,000 million (annual interest rate: 0.80%; issue date: 21 September 2018; maturity date: 21 September 2028) and the 20th unsecured corporate bond of ¥25,000 million (annual interest rate: 2.12%; issue date: 21 September 2018; maturity date: 21 September 2038).」
On 21 September 2018, the company issued a total of ¥35 billion in unsecured corporate bonds and conducted additional direct financing. - FY2019-Q2AdvancedAnnual report
「During the six-month consolidated cumulative period under review, we issued ¥35,000 million in bonds. This comprised the 19th unsecured corporate bond of ¥10,000 million (annual interest rate: 0.80%; issue date: 21 September 2018; maturity date: 21 September 2028) and the 20th unsecured corporate bond of ¥25,000 million (annual interest rate: 2.12%; issue date: 21 September 2018; maturity date: 21 September 2038).」
On 21 September 2018, the company issued a total of ¥35 billion in unsecured corporate bonds and conducted additional direct financing. - FY2018AdvancedAnnual report
「Net cash provided by financing activities was ¥86,246 million, mainly due to proceeds from the issuance of bonds.」
In the fiscal year ended March 2018, the company also issued the 17th and 18th unsecured corporate bonds and other instruments, bringing the year-end balance of bonds to ¥179,788 million. - FY2018-Q3AdvancedAnnual report
「During the nine-month consolidated cumulative period under review, we issued ¥41,500 million in bonds. This comprised the 16th unsecured corporate bond of ¥40,000 million (annual interest rate: 1.78%; issue date: 10 August 2017; maturity date: 10 August 2027), the 9th unsecured corporate bond of ¥1,000 million (annual interest rate: 0.2%; issue date: 30 June 2017; maturity date: 28 June 2024) and the 10th unsecured corporate bond of ¥500 million (annual interest rate: 0.24%; issue date: 25 September 2017; maturity date: 24 September 2027).」
Bond issuance during the nine-month consolidated cumulative period under review totaled ¥41,500 million, representing an additional direct financing transaction. In addition, a blanket resolution was adopted authorizing the issuance of up to ¥50 billion in domestic unsecured straight bonds between 14 February 2018 and the end of March 2018. - FY2018-Q2AdvancedAnnual report
「During the six-month consolidated cumulative period under review, we issued ¥40,500 million in bonds. This comprised the 16th unsecured corporate bond of ¥40,000 million (annual interest rate: 1.78%; issue date: 10 August 2017; maturity date: 10 August 2027) and the 10th unsecured corporate bond of ¥500 million (annual interest rate: 0.24%; issue date: 25 September 2017; maturity date: 24 September 2027).」
In August and September 2017, the company issued a total of ¥40.5 billion in unsecured corporate bonds and conducted additional financing. - FY2018-Q1AdvancedAnnual report
「Based on a resolution adopted at a meeting of our Board of Directors held on 18 July 2017, we issued the following bond on 10 August 2017. 16th unsecured corporate bond Total issue amount: ¥40 billion Maturity date: 10 August 2027 (10-year bond) Use of proceeds: Funds for repayment of borrowings, redemption of bonds and working capital」
In August 2017, the company issued ¥40 billion in 10-year unsecured corporate bonds and conducted an additional financing transaction using the proceeds to repay borrowings and bonds and fund working capital. - FY2017AdvancedAnnual report
「Net cash provided by financing activities was ¥56,545 million, mainly due to proceeds from the issuance of bonds.」
In addition to the bonds issued in January 2017, the company issued unsecured corporate bonds and other instruments in March 2017, bringing the year-end balance of bonds to ¥90,311 million. - FY2017-Q3AdvancedAnnual report
「Based on a resolution adopted at a meeting of the Board of Directors held on 16 January 2017, we issued the following bonds on 26 January 2017. 1. 14th unsecured corporate bond (3) Total issue amount: ¥12 billion (10) Use of proceeds: Funds for bond redemption and repayment of borrowings 2. 15th unsecured corporate bond (3) Total issue amount: ¥28 billion (10) Use of proceeds: Funds for bond redemption and repayment of borrowings」
On 26 January 2017, the company made an additional issue of ¥40 billion in unsecured corporate bonds, using the proceeds to redeem bonds and repay borrowings. - FY2017-Q2First statedAnnual report
「During the cumulative second quarter of the current fiscal year, we issued ¥40,000 million in bonds. This comprised ¥10,000 million of the 12th unsecured bond, with an annual interest rate of 0.68%, an issue date of 22 July 2016 and a maturity date of 22 July 2019, and ¥30,000 million of the 13th unsecured bond, with an annual interest rate of 1.10%, an issue date of 22 July 2016 and a maturity date of 22 July 2021.」
The Group issued a total of ¥40 billion in unsecured bonds on 22 July 2016 to raise funds.