Environmentally Friendly Universal Plating Technology through the MAP Project
First written in FY2025. 6 of 9 entries say "Advanced", first in 2026-06-30. Latest entry: FY2026.
1 other company's latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「The research also succeeded in forming low-resistance copper films on glass and sapphire substrates, which had previously been difficult. Good results were also obtained in adhesion tests conducted in accordance with JIS standards, confirming the potential application of the technology to glass-core substrates, which are attracting attention for next-generation semiconductor packages. In March 2026, the Company presented the research results at the 73rd Annual Meeting of the Japan Society of Applied Physics. The presentation reported that optimizing the film-forming conditions produced a copper-film sheet resistance of approximately 0.3Ω/□ and a resistivity of approximately 5mΩcm, characteristics comparable to those of metallic copper.」
The MAP project progressed from establishing an R&D base and conducting joint research with Ritsumeikan University to demonstration for glass-core substrates and presentation at an academic conference. A copper-film sheet resistance of approximately 0.3Ω/□ and resistivity of approximately 5mΩcm have been confirmed. - FY2025First statedAnnual report
「In July 2025, we launched the “MAP (Mist-Assisted universal Plating) Project” to develop coating technology using a universal plating method developed independently by the company as a next-generation growth business.」
Beginning in July 2025, the company launched a new project to develop a low-cost, environmentally considerate coating technology capable of stable supply, targeting growth industries including communications, semiconductors, medical care, aerospace and renewable energy.