Commercialization of Heat-Dissipation Substrates
First written in FY2022. 12 of 16 entries say "Advanced", first in FY2023. Latest entry: 2026-07-17.
The whole theme swung hardest in 2022: 3 of 7 companies on the "Worse" side.
7 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「The thermal management substrates have received mass-production qualification for products with thermal conductivity of 170 W/m·K and 200 W/m·K, and the market evaluation of customer products is under way. In addition, development of the 230 W/m·K product has been completed and sample distribution to the market has begun.」
The company reported concrete progress on the thermal management substrates, including mass-production qualification for the 170 W/m·K and 200 W/m·K products, completion of development of the 230 W/m·K product and the start of sample distribution. At the same time, an impairment loss was recognized due to delays in mass-production qualification for other applications. - FY2025AdvancedAnnual report
「For the thermal management substrate, mass-production trials and qualification work are under way for customer-specific products ahead of mass-production shipments in the fiscal year ending March 2026.” “The company is exhibiting at exhibitions in Japan and overseas with 株式会社U-MAP and pursuing new users for the thermal management substrate.」
For the thermal management substrate, the company is making concrete progress on mass-production trials and qualification work ahead of mass-production shipments in the fiscal year ending March 2026, as well as pursuing new users through exhibitions in Japan and overseas with U-MAP. - FY2025-H1AdvancedAnnual report
「株式会社U-MAP has established mass-synthesis technology and a mass-production system for high-quality “Thermalnite®.” In May 2024, it also began shipping mass-production specification samples of thermal management substrates jointly developed with us, its partner company, featuring high thermal dissipation and high mechanical strength through the addition of “Thermalnite®.” Through this project, we aim to understand market and technology trends for thermal management substrates and to continuously develop, manufacture and sell high-performance thermal management substrates containing “Thermalnite®.” (2) Transfer amount: ¥100 million (3) Scheduled transfer date: 15 November 2024」
It states that U-MAP established mass-synthesis technology and a mass-production system for Thermalnite® and began shipping mass-production specification samples of thermal management substrates jointly developed with the company in May 2024. The company also decided to invest ¥100 million to subscribe for U-MAP’s J-KISS-type stock acquisition rights and has moved into the stage of developing, manufacturing and selling high-performance thermal management substrates. - FY2024AdvancedAnnual report
「For the thermal management substrate, manufacturing equipment began operating in August 2023, and the production system will continue to be developed toward full-scale mass production in the fiscal year ending March 2025.」
Following the start of joint development with U-MAP and the installation of new equipment, the thermal management substrate manufacturing equipment began operating in August 2023. The company is developing its production system and pursuing new users toward full-scale mass production in the fiscal year ending March 2025. - FY2024-Q3RestatedAnnual report
「The main factor was a ¥242 million increase in machinery and equipment and vehicles, net, due to the replacement of the glass melting furnace feeder and the installation of new heat-dissipation substrate manufacturing equipment at the head office plant in Kashiwa, Chiba, among other work.」
The newly installed manufacturing equipment for heat-dissipation substrates continues to be cited as a factor behind the increase in machinery and equipment. The company has reiterated the equipment-related progress toward establishing a mass-production system reported through the previous quarter. - FY2024-Q2AdvancedAnnual report
「The main factor was a ¥264 million increase in machinery and equipment and vehicles, net, due to the replacement of the glass melting furnace feeder and the installation of new heat-dissipation substrate manufacturing equipment at the head office plant in Kashiwa, Chiba, among other work.」
Regarding commercialization of heat-dissipation substrates, the company states that it established new manufacturing equipment for heat-dissipation substrates following the start of collaborative development with U-MAP. This represents progress in equipment development toward establishing a mass-production system. - FY2023AdvancedAnnual report
「The company has begun collaborative development aimed at establishing a mass-production system using an aluminum nitride composite material containing “Thermalnite,” a proprietary material developed by U-MAP Co., Ltd. consisting of fibrous aluminum nitride single crystals, together with the company’s production technology for ceramic sheets.」
For heat-dissipation substrates, the company began collaborative development aimed at establishing a mass-production system by combining U-MAP’s proprietary material with the company’s ceramic-sheet production technology. - FY2022First statedAnnual report
「Commercialization of heat-dissipation substrates that contribute to improved power electronics performance」
The company has newly identified the commercialization of heat-dissipation substrates for power electronics as a product initiative addressing changes in the business environment, including decarbonization.