Announced details
Submount substrates for laser diodes (LDs), primarily used in data centers, and optical communications (optoelectronic convergence technology)
Specifications for the 200 W/m·K and 230 W/m·K products and ultra-thin substrates with a thickness of more than 0.1 mm
OKAMOTO GLASS CO.,LTD. and 株式会社U-MAP have a collaboration relationship. The relationship with the domestic semiconductor substrate manufacturer is a business relationship involving mass-production qualification and initial shipment. Capital and personnel relationships: not disclosed.
株式会社U-MAP: Nagoya, Aichi Prefecture. Domestic semiconductor substrate manufacturer: company name and other details undisclosed.
Mass-production qualification for aluminum nitride heat-dissipation substrates
Domestic semiconductor substrate manufacturer (name undisclosed)
In this announcement the company addresses none of Contract Value / Offering price / Impact on Business Performance.
| Item | Details |
|---|---|
| Names of Products / Services Covered | Aluminum nitride heat-dissipation substrates with a thermal conductivity of 200 W/m·K, 230 W/m·K product, Ultra-thin heat-dissipation substrates with a thickness of more than 0.1 mm |
| Counterparty | 株式会社U-MAP; domestic semiconductor substrate manufacturer (name undisclosed) |
| Counterparty overview | 株式会社U-MAP: Nagoya, Aichi Prefecture. Domestic semiconductor substrate manufacturer: company name and other details undisclosed. |
| Relationship with the Company | OKAMOTO GLASS CO.,LTD. and 株式会社U-MAP have a collaboration relationship. The relationship with the domestic semiconductor substrate manufacturer is a business relationship involving mass-production qualification and initial shipment. Capital and personnel relationships: not disclosed. |
| Launch date | Initial shipment: scheduled to take place or already underway as of the announcement on 17 July 2026. 230 W/m·K product and ultra-thin substrates with a thickness of more than 0.1 mm: prototype supply has commenced. |
| Applicable area | Submount substrates for laser diodes (LDs), primarily used in data centers, and optical communications (optoelectronic convergence technology) |
| Award/certification name | Mass-production qualification for aluminum nitride heat-dissipation substrates |
| Awarding / certifying body | Domestic semiconductor substrate manufacturer (name undisclosed) |
| Quantitative Effects | Specifications for the 200 W/m·K and 230 W/m·K products and ultra-thin substrates with a thickness of more than 0.1 mm |
Items this document does not state (9)
These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.
The reasons the company gives
The company's own explanation, not something inferred from the numbers.Optical communications (optoelectronic convergence technology) are being increasingly adopted to address heat generated by servers during data processing at data centers, increasing the importance of laser submounts (heat-dissipation substrates) that enable LDs to operate reliably.