Expansion of product and market areas and organizational strengthening in the semiconductor business
First written in FY2017. 4 of 5 entries say "Advanced", first in FY2020. Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026AdvancedAnnual report
「In December 2025, we established SCREEN Advanced Technology Center of America, LLC in the United States as a research and development center.」
The Company established ATCA, a research and development center in New York State, and is strengthening development capabilities through collaboration with Japanese research and development centers, customers and research institutions. - FY2024AdvancedAnnual report
「Against this backdrop, we integrated the new S³-5 plant, which began operating in January 2024, with the automated S³-3 plant and S³-4, which began operating in January 2023, creating a more efficient production flow from manufacturing through shipment than before.」
S³-5 began operating in January 2024, creating an integrated production flow with S³-3 and S³-4. Efforts to expand production capacity and increase automation have advanced to the operating stage. - FY2023AdvancedAnnual report
「Entered into a joint development agreement with Belgium-based imec to accelerate technology development Entered into a joint development agreement with US-based IBM to develop next-generation cleaning processes Launched the single-wafer cleaning system “SU-3400,” offering world-class productivity and high processing performance」
The semiconductor business entered into joint development agreements with imec and IBM, launched the SU-3400, began operations at S³-4 and started construction of S³-5. - FY2020AdvancedAnnual report
「To improve profitability, we will reduce procurement costs by reviewing suppliers, including expanding overseas sourcing, and improve productivity by increasing the operating rate of the latest semiconductor manufacturing equipment plant, S3-3 (S-Cube Three).」
For the semiconductor business, the Company outlined specific measures: improving productivity using S3-3, reviewing suppliers including overseas sourcing, and improving investment efficiency using ROIC. - FY2017First statedAnnual report
「We will strengthen our position across a broad range of device areas, including the rapidly growing NAND flash memory market, logic devices, where miniaturization is continuing, and sensors, where both application volume and demand are expanding. We will also prepare a competitive product lineup to capture the Chinese market, where investment is expected to increase further. Organizational strengthening is another key initiative.」
During the 3-year Challenge 2019 period, the Company plans to prepare product lineups for NAND flash, logic, sensors and the Chinese market, establish a business headquarters with an overview of the entire business, and deploy personnel flexibly.