Raising Acquisition and Investment Funds Through Bond Issuance Registration
First written in FY2019-Q1. 10 of 11 entries say "Advanced", first in FY2019-Q2. Latest entry: 2026-10-09.
62 other companies' latest entry also says "Advanced".
- 2026-10-09AdvancedShare Issuance and Disposal
「19．資 金 使 途 社債償還資金に充当する予定。」
第26回無担保社債250億円の発行条件を決定し、2026年10月21日の払込を予定している。社債償還資金への充当を明示しており、社債発行・償還を含む財務運営の具体的な実行が進展した。 - FY2026AdvancedAnnual report
「While there were sources of increase, including ¥2.9924 billion in proceeds from the issuance of corporate bonds, the decrease was attributable to outflows of ¥5.6796 billion for repayment of long-term borrowings, ¥2.4495 billion for dividend payments and ¥2.065 billion for redemption of corporate bonds.」
While raising approximately ¥29.9 billion through a bond issuance, the company proceeded with the repayment of long-term borrowings and corporate bonds as part of its funding and financial management. - FY2024AdvancedAnnual report
「Increases from proceeds of ¥69.789 billion from bond issuance and ¥50 billion from long-term borrowings, partly offset by decreases from ¥150.930 billion in bond redemptions and ¥84.820 billion in repayments of long-term borrowings」
With respect to funding measures, including the refinancing and redemption of bonds, the Company proceeded with bond issuance and long-term borrowings, as well as the repayment of existing bonds and borrowings. - FY2024-Q3AdvancedAnnual report
「This was mainly due to increases from proceeds of ¥69.789 billion from bond issuance and ¥50 billion from long-term borrowings, partly offset by decreases from ¥150.930 billion in bond redemptions, ¥83.027 billion in repayments of long-term borrowings and ¥12.529 billion in dividend payments.」
The Company raised funds through ¥69.789 billion in bond issuance and ¥50 billion in long-term borrowings, while repaying ¥150.930 billion in bonds and ¥83.027 billion in long-term borrowings, thereby progressing the refinancing and repayment of bonds and borrowings. - FY2024-Q2AdvancedAnnual report
「This was mainly due to increases from proceeds of ¥69.789 billion from bond issuance and ¥10 billion from long-term borrowings, partly offset by decreases from ¥140.605 billion in bond redemptions, ¥28.182 billion in repayments of long-term borrowings and ¥9.545 billion in dividend payments.」
During the cumulative second quarter under review, the Company raised ¥69.789 billion through bond issuance while redeeming ¥140.605 billion in bonds, and carried out the refinancing and repayment of bonds and borrowings. - FY2023AdvancedAnnual report
「At a meeting of the Board of Directors held on 25 September 2023, the Company resolved to redeem in full before maturity the domestic unsecured subordinated bonds with a subordinated covenant issued on 29 November 2018, and to refinance part of the redemption amount through domestic unsecured straight bonds.」
The Company resolved to redeem the ¥140 billion subordinated bonds before maturity and refinance part of them through domestic unsecured straight bonds totaling ¥70 billion. - FY2022-Q2AdvancedAnnual report
「Proceeds from bond issuance 79,619」
During the cumulative second quarter under review, the Company recorded proceeds of ¥79.619 billion from bond issuance, and its funding measures, including acquisitions and capital expenditures, progressed to the issuance and receipt-of-funds stage. - FY2022-Q1AdvancedAnnual report
「1. Pan Pacific International Holdings Co., Ltd. 18th Unsecured Bond; (2) Aggregate issue amount: ¥40 billion; 2. Pan Pacific International Holdings Co., Ltd. 19th Unsecured Bond; (2) Aggregate issue amount: ¥10 billion; 3. Pan Pacific International Holdings Co., Ltd. 20th Unsecured Bond; (2) Aggregate issue amount: ¥30 billion」
Following the end of the previous fiscal year, the Company proceeded to issue a total of ¥80 billion in unsecured bonds to fund capital expenditures, bond redemptions, repayment of borrowings and other purposes. - FY2021AdvancedAnnual report
「Aggregate issue amount: ¥85 billion or less; scheduled issue date: 21 October 2021; intended uses of funds: capital expenditures, repayment of borrowings, and investments and loans」
After the end of the fiscal year, the Company resolved to issue domestic unsecured straight bonds totaling up to ¥85 billion, for capital expenditures, repayment of borrowings and investments and loans. - FY2019-Q2AdvancedAnnual report
「On 29 November 2018, the Company raised a total of ¥140 billion through the issuance of domestic unsecured subordinated bonds with a subordinated covenant (the “Bonds”).」
In connection with the ¥200 billion shelf registration for bond issuance, the Company actually issued ¥140 billion of domestic unsecured subordinated bonds. The maturity date is 28 November 2053. - FY2019-Q1First statedAnnual report
「At a meeting of the Board of Directors held on 11 October 2018, the Company adopted a blanket resolution concerning the issuance of bonds and filed a shelf registration. Planned issue amount: ¥200 billion. Planned issue period: the 2-year period from the scheduled effective date of the shelf registration, from 19 October 2018 to 18 October 2020. Intended uses of funds: capital expenditures, repayment of borrowings, redemption of bonds and investments and loans.」
The Company filed a shelf registration for bond issuance of ¥200 billion to fund acquisitions, capital expenditures, repayment of borrowings and other purposes, with a planned issue period from 19 October 2018 to 18 October 2020.