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Other Disclosures7433Hakuto Co.,Ltd.Trading & Wholesale

伯東 Strengthens Its Japanese Sales Network for Advanced Plasma Process Technology Through a Distributor Agreement with Oxford Instruments

Hakuto entered into a distribution agreement with Oxford Instruments to sell Oxford Instruments’ compound semiconductor process equipment in Japan. This will establish a platform for providing etching and deposition solutions for research and development and mass production to semiconductor customers in Japan.

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Announced details

Compound semiconductor process equipment using Oxford Instruments’ plasma process technologyEtching and deposition solutions
Applicable field (uses covered by this announcement)
Compound semiconductor processesSemiconductor manufacturingResearch and DevelopmentMass productionGaN (gallium nitride) power devicesSiC (silicon carbide) power devicesData communications and optoelectronics using GaAs (gallium arsenide)Data communications and optoelectronics using InP (indium phosphide)
Contract Date2 October 2026 (announced as executed)
Relationship between the counterparty and the company
Hakuto Co.,Ltd.7433
Relationship with the Company

Hakuto entered into a distribution agreement to sell Oxford Instruments’ compound semiconductor process equipment in Japan. Capital and personnel relationships: not disclosed.

CounterpartyOxford Instruments plc (London Stock Exchange, ticker: OXIG)

Headquartered in High Wycombe, UK. Its main markets are materials analysis, semiconductors, healthcare and life sciences, and it provides advanced scientific technology and expertise to academic institutions and companies. Founded in 1959 as the first spin-out company from the University of Oxford. A constituent of the FTSE 250 Index on the London Stock Exchange.

Impact on Business Performance

No specific impact on revenue or profit is provided. The disclosure states that the company aims to support customers and contribute to improvements in quality, productivity and manufacturing efficiency.

The company does not address Contract Value / Offering price.

Announced details
ItemDetails
Names of Products / Services CoveredCompound semiconductor process equipment using Oxford Instruments’ plasma process technology, Etching and deposition solutions
CounterpartyOxford Instruments plc (London Stock Exchange, ticker: OXIG)
Counterparty overviewHeadquartered in High Wycombe, UK. Its main markets are materials analysis, semiconductors, healthcare and life sciences, and it provides advanced scientific technology and expertise to academic institutions and companies. Founded in 1959 as the first spin-out company from the University of Oxford. A constituent of the FTSE 250 Index on the London Stock Exchange.
Relationship with the CompanyHakuto entered into a distribution agreement to sell Oxford Instruments’ compound semiconductor process equipment in Japan. Capital and personnel relationships: not disclosed.
Contract Date2 October 2026 (announced as executed)
Applicable areaCompound semiconductor processes, Semiconductor manufacturing, Research and Development, Mass production, GaN (gallium nitride) power devices, SiC (silicon carbide) power devices, Data communications and optoelectronics using GaAs (gallium arsenide), Data communications and optoelectronics using InP (indium phosphide)
Impact on Business PerformanceNo specific impact on revenue or profit is provided. The disclosure states that the company aims to support customers and contribute to improvements in quality, productivity and manufacturing efficiency.
Items this document does not state (11)
Contract ValueOffering priceLaunch dateAward/certification nameAwarding / certifying bodyRegistration number and expiry dateLocationLocation scaleQuantitative EffectsUsage historySource

These are items the company does not state in this document. We do not leave them blank, nor fill them in from other sources or by inference.

The reasons the company gives

The company's own explanation, not something inferred from the numbers.

Demand for advanced process technology is increasing in Japan’s semiconductor market, against a backdrop of expanding applications for GaN and SiC power devices and data communications and optoelectronics using GaAs and InP. The agreement will also combine the two companies’ technological capabilities, sales strength and technical support capabilities to help customers address challenges including quality, manufacturing performance, productivity and cost optimization.

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伯東 Strengthens Its Japanese Sales Network for Advanced Plasma Process Technology Through a Distributor Agreement with Oxford Instruments | Hakuto Co.,Ltd. (7433) timely disclosure | Komori