Entering the advanced semiconductor packaging business
First written in FY2025. 1 of 3 entries say "Restated". Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026AdvancedAnnual report
「In the advanced semiconductor packaging field, which contributes to lower power consumption, the company continued to consider joint development and collaboration with multiple customers and proceeded with preparations to launch a new business.」
The advanced semiconductor packaging business progressed from a policy of joint development with partner companies to considering joint development and collaboration with multiple customers and establishing the foundation for launching the business. - FY2026-H1RestatedAnnual report
「We are restructuring our product and business portfolio through the sensor business, which includes life-science sensors such as X-ray sensors, IoT sensors including “ZINNSIA,” and industrial sensors, as well as the advanced semiconductor packaging business, which leverages technologies and assets developed through the display business.」
The advanced semiconductor packaging business was reaffirmed as a target for portfolio restructuring under the BEYOND DISPLAY strategy, alongside the sensor business. No new milestones, such as completion of market entry, were disclosed. - FY2025First statedAnnual report
「The company decided to enter the advanced semiconductor packaging business, which is expected to achieve high growth, and to allocate additional management resources to its sensor business.」
The company first explicitly stated its policy of entering the advanced semiconductor packaging business through partnerships, using high-density wiring, thin-film, and glass-processing technologies developed through its display business as a new business pillar under its BEYOND DISPLAY strategy.