U.S.-based Micron and Korean semiconductor package substrate makers have expressed interest in acquisition talks over the sale of Japan Display's Mobara plant, with negotiations expected to proceed at around ¥55 billion.
Multiple data center operators, including U.S.-based Micron Technology, and Korean semiconductor package substrate makers are participating in acquisition talks over the sale of JDI's Mobara plant. The sale price under negotiation is expected to be around KRW 500 billion, equivalent to approximately ¥55 billion. At its August 2026 earnings announcement, JDI disclosed that it was continuing talks with multiple prospective buyers regarding the sale of the Mobara plant's assets.
The focus in this case is the growing momentum behind efforts to achieve the fastest possible operational scale-up by converting the Mobara plant for backend packaging, glass substrates and AI data center applications. Existing infrastructure, including cleanroom suitability, ceiling height, and power receiving and substation equipment, will determine whether the conversion succeeds.
Micron is said to be seeking to secure a robust backend base in Japan in conjunction with its plan to expand advanced DRAM production at its Hiroshima plant. One view is that acquiring the Mobara plant would enable the company to establish a domestic assembly and testing base in a short period, timed to the start of operations at the new Hiroshima building.
Meanwhile, eLEAP-related manufacturing equipment has been sold to China's HKC, and the rights to the patents themselves are also said to present difficulties. Views have emerged that the sale of Mobara could mark a watershed for Japan's domestic semiconductor supply chain and JDI's financial restructuring.