Research and Development in Specialty Materials and High-Performance Printed Circuit Boards
First written in FY2018. 7 of 8 entries say "Advanced", first in FY2019. Latest entry: FY2026.
51 other companies' latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「To meet market needs for higher performance, greater density and higher current capacity in electronic equipment, we are engaged in R&D on a range of high-value-added substrates. We are developing metal-core substrates based on aluminum or copper, which have excellent thermal conductivity, and heavy-copper substrates that combine high-current capacity with heat dissipation, as substrates that contribute to the stable operation of high-heat-generating devices.」
The company has specified its R&D focus on high-performance substrates, including metal-core and heavy-copper substrates, to meet demands for higher performance, greater density and higher current capacity. - FY2025AdvancedAnnual report
「We are pursuing research into technologies including metal-core substrates based on aluminum or copper, which have high thermal conductivity, and heavy-copper-foil substrates that combine high-current capacity with heat dissipation, as high-heat-dissipation substrates for high-current applications and heat-generating components.」
The company has specified its R&D focus on high-heat-dissipation substrates for high-current applications and heat-generating components, including high-thermal-conductivity metal-core substrates and heavy-copper-foil substrates. - FY2023AdvancedAnnual report
「In addition, we are pursuing the refinement of printed wiring boards, for which customer needs are strong, the establishment of production technologies for printed wiring boards using specialty materials, and the improvement and development of copper-pin insertion substrates (S-MIT), which efficiently dissipate heat from heat-generating components for which demand remains strong across a range of applications.」
In addition to the development and commercialization of transparent-substrate-related products, the company has expanded its R&D scope to include finer printed wiring boards, specialty materials, and the improvement and development of copper-pin insertion substrates (S-MIT). Total R&D expenses were ¥76 million. - FY2021AdvancedAnnual report
「We are pursuing diversified development and commercialization to open up potential markets, including high-heat-resistance film substrates (SPET-α and SPET-Color), high-thermal-conductivity flexible substrates (kon-jak), multifunctional substrates emphasizing transparency (SPET-MM), increasingly fine-line transparent antenna film substrates for 5G (SPET-SG), substrates for three-dimensional wiring (FCCL), and quick-heating transparent heater films, whose adoption is expanding in automotive and other applications.」
In addition to the existing SPET series, kon-jak, SPET-MM and transparent heater films, the scope of development and commercialization has expanded to include SPET-SG for 5G applications and FCCL for three-dimensional wiring. - FY2020AdvancedAnnual report
「The company has developed proprietary substrates centered on its core transparent-substrate technology and achieved the development and commercialization of products including transparent flexible substrates for new applications (SPET, SPET-α and SPET-Color), display devices aimed at enabling various forms of illumination (耽美, 萬美 and BANVISION), flexible substrates with high thermal conductivity (kon-jak), transparent flexible substrates with invisible wiring (SPET-MM), and transparent heater films for automotive applications that heat up quickly.」
For multiple substrates, display devices and automotive heater films using the core transparent-substrate technology, the company explicitly states for the full year that development and commercialization have been achieved. Total R&D expenses were ¥118 million. - FY2020-Q1AdvancedAnnual report
「For new substrates using transparent core technology, we are developing a mass-production framework at a domestic plant, but it is expected to take more time before they have a material impact on earnings.」
The new substrates using transparent core technology have progressed from development and commercialization to preparations for mass production at a domestic plant. However, a substantial contribution to earnings is not expected for some time. - FY2019AdvancedAnnual report
「The company has developed proprietary substrates centered on its core transparent-substrate technology and achieved the development and commercialization of products including transparent flexible substrates for new applications (SPET, SPET-α and SPET-Color), flexible substrates with high thermal conductivity (kon-jak), transparent flexible substrates with invisible wiring (SPET-MM), and transparent heater films for automotive applications that heat up quickly.」
The company explicitly states that multiple products using its core transparent-substrate technology have progressed from development to commercialization. - FY2018First statedAnnual report
「In addition, we are pursuing the development of finer printed wiring boards, for which customer needs are strong, the establishment of production technologies for printed wiring boards using specialty materials, and the development of high-thermal-conductivity substrates and high-gloss resist substrates for LEDs, which have recently attracted attention as part of environmental initiatives.」
The company describes R&D initiatives covering multiple high-performance substrates, including finer printed wiring boards, specialty materials, high-thermal-conductivity substrates and high-gloss resist substrates.