Risk of failing to respond to structures that could replace the backplane approach
First written in FY2020. 4 of 5 entries say "Restated". Latest entry: FY2025.
1 other company's latest entry also says "Restated".
- FY2025RestatedAnnual report
「Over the long term, technological innovation may drive further miniaturization and higher density, and new electronic equipment structures may emerge to replace the backplane architecture and the motherboard architecture, which integrates various functions onto a single board.」
The risk of adapting to new electronic equipment structures that replace the backplane architecture continues to be disclosed. - FY2024RestatedAnnual report
「Over the long term, technological innovation may drive further miniaturization and higher density, and new electronic equipment structures may emerge to replace the backplane architecture and the motherboard architecture, which integrates various functions onto a single board.」
The risk of adapting to new electronic equipment structures that replace the backplane architecture continues to be disclosed. - FY2022RestatedAnnual report
「Over the long term, technological innovation may drive further miniaturization and higher density, and new electronic equipment structures may emerge to replace the backplane architecture and the motherboard architecture, which integrates various functions onto a single board.」
The risk of adapting to new electronic equipment structures that replace the backplane architecture continues to be disclosed. - FY2021RestatedAnnual report
「Over the long term, technological innovation may drive further miniaturization and higher density, and new electronic equipment structures may emerge to replace the backplane architecture and the motherboard architecture, which integrates various functions onto a single board.」
The risk of adapting to new electronic equipment structures that replace the backplane architecture continues to be disclosed. - FY2020First statedAnnual report
「Over the long term, technological innovation may drive further miniaturization and higher density, and new electronic equipment structures may emerge to replace the backplane architecture and the motherboard architecture, which integrates various functions onto a single board.」
The risk to operating results if the Company cannot adapt to new electronic equipment structures.