Development of a high-precision wire bonder using ultrasonic-assisted thermocompression bonding
First written in FY2020. 4 of 6 entries say "Advanced", first in FY2021. Latest entry: FY2026.
No other company in this theme has enough history to compare yet.
- FY2026AdvancedAnnual report
「Demand for bonders for optical transceivers for data centers is increasing, and the company developed a model capable of higher-speed operation.」
Following its wide-area wire bonder, the company expanded its development targets to bonders for optical transceivers for data centers and developed models capable of higher-speed operation. - FY2025AdvancedAnnual report
「During the current consolidated fiscal year, the company developed a bonder for advanced packages in response to demand for higher stacking density and miniaturization. Demand for bonders for optical transceivers for data centers is also increasing, and the company developed a model capable of higher-speed operation.」
The company expanded its development targets from wide-area wire bonders to bonders for advanced packages and high-speed optical transceivers. - FY2021AdvancedAnnual report
「The company also developed a wide-area wire bonder with improved bondability through the installation of a new ultrasonic transducer and a new image-recognition algorithm.」
Following its conventional high-precision wire bonder, the company has described the development of a wide-area model equipped with a new ultrasonic transducer and a new image-recognition algorithm. - FY2020First statedAnnual report
「The company developed a high-precision wire bonder using ultrasonic-assisted thermocompression bonding, with improved bondability through the installation of a new ultrasonic transducer.」
The company has, for the first time, described the development of a high-precision wire bonder equipped with a new ultrasonic transducer and improved bondability.