Development and Launch of New Equipment to Improve Yields and Support Semiconductor Miniaturization
First written in FY2022-Q2. 14 of 18 entries say "Advanced", first in FY2022-Q3. Latest entry: 2026-10-20.
1 other company's latest entry also says "Advanced".
- FY2026AdvancedAnnual report
「Going forward, in addition to steadily capturing further demand for these systems, where inquiries remain active, we will focus on developing and expanding sales of TB/DB equipment for PLP, for which some volume-production orders have already been secured, and for HBM dies, which are currently undergoing volume-production process evaluation, and work to further increase orders and sales.」
In addition to growth in TB/DB equipment for WLP used in advanced semiconductors for AI applications, volume-production orders were secured for PLP, while TB/DB equipment for HBM dies advanced to the volume-production process evaluation stage. - FY2025AdvancedAnnual report
「Going forward, in addition to steadily capturing further demand for wafer handling systems, where inquiries remain active, we will focus on developing and expanding sales of bonder and debonder equipment for panel-level packaging (PLP), silicon photonics, and other applications, which are key to further business growth, and work to further increase orders and sales.」
Wafer handling systems for advanced semiconductors used in AI applications led shipments and orders. In addition to conventional PLP applications, the development and expanded sales of bonder and debonder equipment for silicon photonics were specified. - FY2025-H1AdvancedAnnual report
「With no full-scale recovery in demand for solder ball mounters, wafer handling systems for advanced semiconductor packaging used in AI applications led shipments and orders, both of which progressed steadily. Going forward, in addition to steadily capturing further demand for wafer handling systems, where inquiries remain active, we will focus on expanding sales of systems for panel-level packaging (PLP) and permanent bonding lines, which are key to future business growth, and work to further increase orders and sales.」
Wafer handling systems for advanced semiconductor packaging used in AI applications led shipments and orders. In addition to capturing further demand, expanding sales of PLP systems and permanent bonding lines was identified as a new priority initiative. - FY2024AdvancedAnnual report
「For wafer handling systems used in the wafer-thinning process required for 2.5D/3D integration, including bonder and debonder equipment, we will work to expand sales for 2.5D/3D integration, enter panel-level packaging, and address advanced HBM applications.」
In addition to expanding sales of existing wafer handling systems and equipment for power semiconductors, the company specified 2.5D/3D integration, panel-level packaging, and advanced HBM as target areas for market entry. - FY2024-Q3RestatedAnnual report
「Meanwhile, orders and shipments of wafer handling systems for advanced semiconductor packaging used in AI servers and other applications, as well as UV/plasma equipment for power semiconductors, remained solid. Going forward, the company will work to further increase orders and sales by capturing the recovery in investment and demand for new solder ball mounter models jointly developed with JUKI CORPORATION and launched in the first quarter.」
Orders and shipments of wafer handling systems and UV/plasma equipment for power semiconductors remained solid, while the policy of expanding through demand capture for new models jointly developed with JUKI continues. - FY2024-Q2AdvancedAnnual report
「Meanwhile, amid growing investment demand for advanced semiconductors used in generative AI servers, orders and shipments progressed steadily, centered on wafer handling systems, which play an important role in wafer thinning for advanced packaging. Going forward, we will work to further increase orders and sales by capturing demand for UV and plasma equipment for power semiconductors and for new solder ball mounter models jointly developed with JUKI CORPORATION and launched in the first quarter.」
Orders and shipments progressed steadily, centered on wafer handling systems. The company also explicitly stated that new solder ball mounter models jointly developed with JUKI had already been launched in the first quarter, identifying them, together with UV and plasma equipment for power semiconductors, as targets for demand capture. - FY2024-Q1AdvancedAnnual report
「In response to growing investment demand for advanced semiconductors used in generative AI servers, orders built steadily, centered on wafer handling systems, which play an important role in wafer thinning for advanced packaging. Sales also got off to a solid start, partly because projects scheduled for shipment in the previous fiscal year, including solder ball mounters, slipped into the current fiscal year. Going forward, in addition to wafer handling systems, we will work to further increase orders and sales by capturing demand for plasma equipment for power semiconductors and launching new solder ball mounter models jointly developed with JUKI CORPORATION.」
Orders built steadily, centered on wafer handling systems, and sales of solder ball mounters and other products got off to a solid start. The company also identified plasma equipment for power semiconductors and new models jointly developed with JUKI as growth initiatives. - FY2023AdvancedAnnual report
「For our core solder ball mounter equipment, we will work to expand market share by developing new products in collaboration with JUKI CORPORATION. We will also seek to further expand our business through a broader product lineup, including wafer handling systems for 3D integration that contribute to multilayering and equipment for power semiconductors acquired from TOKYO OHKA KOGYO CO.,LTD.」
The focus progressed from expanding orders for existing equipment to expanding the product lineup, including new products developed with JUKI and wafer handling and power semiconductor equipment acquired from TOKYO OHKA KOGYO CO.,LTD. - FY2023-Q3ReframedAnnual report
「Inquiries for equipment for power semiconductors and other applications, for which medium- to long-term demand growth is expected, are currently active, and we will continue to focus on converting these inquiries into orders.」
The focus shifted from the launch and order expansion of wafer-compatible solder ball mounter equipment and plasma laser repair equipment to securing inquiries for equipment for power semiconductors and other applications. - FY2023-Q1Cited as achievedAnnual report
「We will continue to focus on expanding orders for the wafer-compatible solder ball mounter equipment and plasma laser repair equipment launched in the previous consolidated fiscal year.」
The wafer-compatible solder ball mounter equipment and plasma laser repair equipment launched in the previous consolidated fiscal year were cited as past product launches and identified as targets for future order expansion. - FY2022-Q3AdvancedAnnual report
「We are meeting customer needs by providing solder ball mounter systems incorporating processes from flux printing through inspection and repair, and are also strengthening our response to advanced packages, for which further demand growth is expected.」
For ball mounter systems, the company began providing systems incorporating processes from flux printing through inspection and repair, expanding this initiative to strengthen its response to advanced packages. - FY2022-Q2First statedAnnual report
「To achieve further growth, we developed and launched a plasma laser repair system that contributes to improved yields and a ball mounter system for balls with a diameter of Φ30μm, designed to address semiconductor miniaturization.」
The company developed and launched a plasma laser repair system for improving yields and a ball mounter system for balls with a diameter of Φ30μm.