TOKYO OHKA KOGYO has decided to establish a joint venture with AI Mechatronic. The joint venture is scheduled to be established on 31 October 2026, with TOKYO OHKA KOGYO holding a 51% stake and AI Mechatronic holding 49%.
TOKYO OHKA KOGYO announced on the 20th that it had decided to establish a joint venture with AI Mechatronic. The joint venture is scheduled to be established on 31 October 2026, with TOKYO OHKA KOGYO holding a 51% stake and AI Mechatronic holding 49%.
The new company will develop integration technologies for 3D packaging and provide field engineering services, with the aim of improving its ability to respond to customer requirements. It also plans to accelerate the development of technologies for next-generation advanced semiconductor packages, including panel-level packaging (PLP).
AI Mechatronic also started with bid indications, according to reports.