Expansion of the Semiconductor and High-Precision Laser Processing Businesses Through Acquisition by Via Mechanics
First written in FY2025. 2 of 5 entries say "Advanced", first in FY2026. Latest entry: 2026-08-06.
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- 2026-08-06AdvancedEarnings
「However, supported by the substantial order backlog, we are expanding production capacity and promoting shipments and installation in line with delivery schedules. Revenue is expected to increase sequentially from the second half onward.」
For the electronics process business, including Via Mechanics, the Company specified the execution phase of business expansion through increased production capacity and shipment and installation efforts supported by the order backlog. - FY2026AdvancedAnnual report
「Going forward, our Group will establish a complementary relationship between our automation solutions and Via Mechanics' high-precision drilling machines and ultra-precision laser processing machines, significantly expand our customer base in the semiconductor industry, and invest capital in high-value-added products, including drilling machines and laser processing machines.」
Following the completion of the acquisition of ビアメカニクス, the business concept of combining drilling machines and ultra-precision laser processing machines for semiconductor substrates with automation solutions was incorporated into the full-year consolidated business and new business unit plan. - 2026-05-14Cited as achievedEarnings
「We believe there is a very high degree of compatibility between the Company’s core technologies, including laser technology, automation equipment, IoT-based service support and production and supply systems, and Via Mechanics’ laser drilling technology and technologies for making manufacturing equipment faster and more precise.」
The positioning of the business areas and technology integration following the acquisition of Via Mechanics was reiterated in the full-year earnings report. - FY2026-H1AchievedAnnual report
「Under this agreement, we completed the acquisition of the relevant shares effective 1 July 2025 and made the company a consolidated subsidiary.」
For ビアメカニクス, the acquisition of all shares and its consolidation as a subsidiary were completed effective 1 July 2025. - FY2025First statedAnnual report
「At a meeting of the Board of Directors held on 17 April 2025, we resolved to acquire all issued shares of ビアメカニクス株式会社 from funds and other entities advised by Advantage Partners, and make it a consolidated subsidiary. We entered into a share transfer agreement on the same date.」
We entered into an agreement to acquire 100% of ビアメカニクス, which develops drilling machines and laser processing machines for semiconductor package substrates and printed circuit boards, with the business combination scheduled for 1 July 2025. The acquisition consideration is ¥51,000 million, and the parties aim to combine the business with automation, IoT and laser technologies.